bga x ray inspection system
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Unicomp AX8200max Μηχάνημα επιθεώρησης ακτίνων Χ για επιθεώρηση ελαττωμάτων καλωδίωσης
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Technical Specifications of BGA Xray machine AX8200max System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC
Πλαστή μηχανή ακτίνας X επιθεώρησης EMS BGA για τα τμήματα ηλεκτρονικής
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600x Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area 435mm x 385mm X-ray Leakage < 1uSv/h OUR SERVICE
1uSv/H χαρτογράφηση εξοπλισμού BGA CNC επιθεώρησης ακτίνας X μπαταριών λίθιου
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200B The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Μηχανή ανίχνευσης ακτίνας X Unicomp AX8200 100KV για BGA CSP
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Μηχανή 90kV επιθεώρησης ακτίνας X CSP για τη συγκόλληση ηλιακών κυττάρων
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
Εικόνα επιθεώρησης ακτίνων Χ εξαιρετικής ανάλυσης κατά την επιθεώρηση εσωτερικού της κεραίας με το Hot Sales Model AX7900
AX7900 Super Resolution X-Ray Inspection System for Antenna Internal Inspection The UNICOMP AX7900 X-Ray Inspection System delivers superior resolution imaging for comprehensive internal inspection of antenna components and other electronic assemblies. System Overview Equipped with a 90kV/5μm microfocus X-ray tube and high-performance FPD flat-panel detector, the AX7900 features a versatile multifunctional workstation. The system includes standard XY multi-axis platform
Ανιχνευτής 130KV τσιπ FPD κτυπήματος εξοπλισμού ανίχνευσης ακτίνας X SMT BGA για Semicon
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image
Εξοπλισμός επιθεώρησης ακτίνας X Unicomp AX8200MAX για τον ημιαγωγό
Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable)
