bga x ray inspection system
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Εξοπλισμός ελέγχου με ακτίνες Χ για PCB με κατανάλωση ισχύος 1,0 kW 1280 L x 1220 W x 1615 H mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Inspection Table of Large Dimensions, Laser Pinpointing for Exact Positioning Precise Control
Βιομηχανία Ηλεκτρονική Βιομηχανία Εξοπλισμός ελέγχου με ακτίνες Χ για σύρμα 1280x1220x1615mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Large-Scale Inspection Table with Laser Pinpointing for Precise Localization High-Precision
Ανάλυση αποτυχίας συστημάτων επιθεώρησης AX8500 ακτίνας X Unicomp γραφείου ηλεκτρονικής SMT
Electronics SMT Cabinet Unicomp X-Ray Inspection System AX8500 Failure Analysis Features: ● 100KV 5μm X-Ray tube. ● FPD Detector. ● Real-time image. ● 1000X system magnification. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. ● Modular design with In-line expansibility. ● Economical and Practical. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
Σε απευθείας σύνδεση σύστημα συνδέσμων άξονα εξοπλισμού FPD 6 επιθεώρησης ακτίνας X ADR λουρίδων οδηγήσεων
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Modular design with In-line expansibility. ● Economical and Practical. ● Real-time image. ● 1000X system magnification. ● 100KV 5μm X-Ray tube. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
Στενός εξοπλισμός CSP επιθεώρησης ακτίνας X σωλήνων 1.6kW για τον ιατρικό ηλεκτρονικό συνδετήρα
close tube x-ray inspection equipment in China high resolution image system for medical Electronic connector inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Ακριβής επιθεώρηση με ακτίνες Χ για τον έλεγχο PCB Διαρροή ακτίνων Χ 1uSv/h Τετάρτη 0-110kV Ρυθμίσιμη
X-Ray Inspection for PCB Quality Control Application of SMT X-Ray machine Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of Desktop X-ray machine Large Size Inspection Table with 360° rotation Laser Locator for Precise Location Maganification (1000X) Accurate Control, CNC Programming Automatic Positioning FPD 55°
Unicomp X-ray AX8300MAX Semiconductor Microfocus Εξοπλισμός επιθεώρησης ακτίνων Χ
Unicomp X-ray AX8300MAX Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel 6.
Κλειστή εικόνα σωλήνων FPD εξοπλισμού επιθεώρησης ακτίνας X Unicomp AX9100 130KV για BGA PCBA
Unicomp AX9100 130KV closed tube X-ray with FPD image detector for BGA,PCBA,Diode and semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Η μηχανή EMS ευθύγραμμο AXI ακτίνας X Unicomp LX2000 CSP BGA επιθεωρεί την τρύπα αέρα Ceremic
Using Unicomp LX2000 inline AXI X-ray to inspect ceremic air hole and cracks with Auto Inspection and Analysing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
