bga x ray inspection system
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Semiconductor BGA Flip Chip Inspection ακτινογραφία AX8300 UNICOMP Έλεγχος πρόσβασης δακτυλικών αποτυπωμάτων
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
Σύστημα επιθεώρησης ακτίνας X Bga μητρικών καρτών με την υπερβολικά μεγάλη περιοχή επιθεώρησης
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, ...
Μόνο κενό BGA σύστημα 40W επεξεργασίας εικόνας μηχανών DXI επιθεώρησης ακτίνας X στάσεων
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and ...
PCBA που συγκολλά τη υψηλή ταχύτητα μηχανών επιθεώρησης ακτίνας X BGA με το μεγάλο πίνακα δειγμάτων
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area φ570mm, max. inspection area ...
Σύστημα επιθεώρησης ακτίνας X ημιαγωγών SMT Bga για την εσωτερική ανίχνευση ατελειών
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
Semiconductor BGA Flip Chip Inspection ακτινογραφία AX8300MAX UNICOMP 5μm Ελάχιστη Ανάλυση
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...
ηλεκτρονική Unicomp συστημάτων επιθεώρησης ακτίνας X 100kV PCBA για το κενό BGA/συγκόλληση
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification ...
Ενισχυτής μηχανών FPD ακτίνας X υπολογιστών γραφείου εστίασης μικροϋπολογιστών PCBA, 48mm X 54mm κάλυψη ακτίνας X
Benchtop Electronics PCBA micro-focus BGA X Ray Inspection Machine OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to customers, with competitive price. 3.We provide one year warranty, free training and whole life technology support. 4.We can arrange the shipment by ...
Μηχανή AX7900 ακτίνας X Unicomp εστίασης μικροϋπολογιστών για την επιθεώρηση ολοκληρωμένου κυκλώματος SMT BGA Semicon
High Magnification cost effective Micro Focus X-ray machine AX7900 for SMT BGA and Semicon IC inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing ...
