bga x ray inspection system
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Σύστημα επιθεώρησης ακτίνων Χ 90KV FPD πιστοποιημένο CE/FDA για την ανίχνευση ελαττωμάτων πυκνωτών
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
Μηχανή 0.5kW CX3000 CSP SMT επιθεώρησης ακτίνας X υπολογιστών γραφείου BGA για ιατρικό
Desktop CX3000 X-ray inspection machine for medical disposable venous needle installation failure analysis OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after
Εξοπλισμός επιθεώρησης ακτίνας X μηχανών 100kV ακτίνας X ηλεκτρονικής BGA CSP 0.5kW
X-ray inspection for Electric Cable Wire Inner Quality Check for broken and twrist defect OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team
Μηχανή επιθεώρησης ακτίνων Χ Unicomp AX8300H με 110kV μικροεστιαστική πηγή ακτίνων Χ και υψηλής ανάλυσης FPD
Επιθεώρηση ακτίνων Χ AX8300H με πηγή μικροεστίασης 110 kV & περιστροφή 360°. Ανίχνευση FPD υψηλής ανάλυσης για ανάλυση BGA, CSP, ημιαγωγών. Πληροί τα πρότυπα ασφαλείας του FDA με διαρροή <1μSv/h.
Υψηλή μηχανή Microfocus επιθεώρησης ακτίνας X συγκόλλησης Unicomp ανάλυσης εικόνας ολοκληρωμένου κυκλώματος
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Εξοπλισμός επιθεώρησης ακτίνας X PCB υψηλής δύναμης
Online inspection system PCB X Ray Machine with high power x-ray sources Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Επιθεώρηση Unicomp AX8200 BGA μηχανών επιθεώρησης ακτίνας X επίδειξης 1.0kW LCD
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Unicomp AX8200max Μηχάνημα επιθεώρησης ακτίνων Χ για επιθεώρηση ελαττωμάτων καλωδίωσης
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Technical Specifications of BGA Xray machine AX8200max System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC
Μηχανή ανίχνευσης ακτίνας X Unicomp AX8200 100KV για BGA CSP
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
