pcb inspection system
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Σφαίρα γκολφ μηχανών ακτίνας X ηλεκτρονικής επιθεώρησης PCB BGA μέσα στον ποιοτικό έλεγχο
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
Ακτίνα X 130kV Unicomp χαρτογράφησης Microfocus AX9100 CNC για τη μητρική κάρτα
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Βιομηχανικό σύστημα 80kV απεικόνισης ακτίνας X/πηγή 90kV με Submicron το εστιακό μέγεθος σημείων
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size FEATURES: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x 380mm,
Μηχανή ψηφιακής ακτινογραφίας & Μηχανή ακτινογραφίας Unicomp AX7900 Για επισκευή PCB και μέτρηση & δοκιμή συγκόλλησης μπάλας IC / BGA
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
Υψηλής ποιότητας μηχανή ελέγχου ακτίνων Χ 90kV Unicomp AX7900 για δοκιμές ακρίβειας ποιότητας BGA
High quality 90kV X ray inspection machine Unicomp AX7900 for BGA quality accuracy testing Description of IC X Ray machine AX7900: It finds widespread application in industries like BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductors, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among various others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise
Ισχυρή διείσδυση μηχανών ακτίνας X BGA σύγχρονη για τα ηλεκτρικά συστατικά
Electronic and electrical components Chinese BGA X-Ray Inspection Machine The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Ανιχνευτής AX8200 εικόνας ακτίνας X FPD 100KV για το PCB FPC SMT BGA
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection Item Definition Specs System Parameters Size 1080(L
Κλειστή μηχανή ακτίνας X ηλεκτρονικής σωλήνων Unicomp 90kV 5um για SMT PCBA BGA
Unicomp 90kV 5um Closed Tube Electronics X Ray Machine For SMT PCBA BGA Unicomp 90kV 5um closed tube CX3000 X-ray Inspection System for SMT PCBA BGA QFN LED soldering void inspection Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution
Υψηλής ακρίβειας PTH διασωλήνωσης PCB συναρμολόγηση ακτίνων Χ AX7900 Unicomp Υψηλή σταθερότητα
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
