pcb inspection system
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Υψηλής ακρίβειας PTH διασωλήνωσης PCB συναρμολόγηση ακτίνων Χ AX7900 Unicomp Υψηλή σταθερότητα
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
Εξαιρετικά υψηλής ανάλυσης ακριβής επιθεώρηση κενού συγκόλλησης PCBA MOS Chip ακτίνων X AX9600 Unicomp Power Component PCB
Ultra High Resolution Accurate Solder Void Inspection PCBA MOS Chip X-ray AX9600 Unicomp Power Component PCB Unicomp Equipped with UNICOMP’s independently developed 160kV high-power open micro-focus X-ray tube, the AX9600 achieves an ultra-fine focal spot of 0.8μm. Combined with 2000× ultra-high optical magnification and superior X-ray penetration performance, it enables high-accuracy void fraction testing for TVS diodes. It is specially optimized for high-precision non
Clear Imaging BGA Void Detection PCBA BGA X-ray AX9600 Unicomp SMT Σύστημα επιθεώρησης συναρμολόγησης PCB
Clear Imaging BGA Void Detection PCBA BGA X-ray AX9600 Unicomp SMT PCB Assembly Inspection System UNICOMP AX9600 adopts an in-house developed 160kV high-power open micro-focus X-ray tube with an ultra-fine 0.8μm focal spot. It supports magnification up to 2000× and offers superior X-ray penetration, enabling precise void content measurement for TVS diodes. Optimized for high-end semiconductor inspection, it caters to high-precision quality control of advanced IC packaging,
Ο ΔΡ μηχανή ακτινογραφιών πολυ-χειριστών 160KV ακτίνας X NDT για τα μικρά πετώντας μέρη alumimum ραγίζει τον έλεγχο πορώδους
Multi-manipulator 160KV Radiography DR X-ray NDT Machine for small alumimum Casting Parts crack porosity checking Technical Data of UNC160s Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum penetration(AL) 100mm/20mm Detector Resolution 3.1LP/mm Our goal is to solve
υψηλή επιθεώρηση ακρίβειας μηχανών ακτίνας X 300kg Benchtop για τη ρίψη κύβων
High accuracy inspection Benchtop Electronics PCBA Unicomp X-ray Machine The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage
Μηχανή ακτίνας X microfocus Unicomp AX8200MAX 5um για την αυτοκίνητη PCBA BGA QFN CSP επιθεώρηση ατελειών συγκόλλησης EMS
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Μηχανή UNICOMP CX3000 ακτίνας X ηλεκτρονικής CSP για το συνδετήρα καλωδίων
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
Τοποθετημένη σε κάψα μηχανή 5μm ακτίνας X ηλεκτρονικής συστατικής αντίστασης μέγεθος σημείων
Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components EMS Semiconductor Electronics X Ray Machine System for BGA and CSP
Μηχανή ακτίνας X ανιχνευτών Unicomp AX8200max FPD για το EMS SMT PCBA QFP
CHINA Leading X-ray manufacturer Unicomp AX8200max machine for EMS SMT PCBA QFP IC SOT package reflow Soldering Void Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
