pcb inspection system
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Μηχανή 6 ακτίνας X Unicomp AX8200Max χειριστής άξονα για CNC την προγραμματίσημη επιθεώρηση
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
Μηχανή Microfocus AX8200 επιθεώρησης ακτίνας X 5um των οδηγήσεων CSP με CNC τη χαρτογράφηση
Unicomp 5um Microfocus AX8200 X Ray Inspection Machine For Automotive Electronics quality control with CNC mapping Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB
Σφραγισμένος σωλήνας μικρού υψηλής ανάλυσης AX8200B μηχανών επιθεώρησης ακτίνας X μπαταριών λίθιου Unicomp 130kV
Unicomp 5um 90kV sealed tube X-Ray Inspection Machine AX8200B for button Lithium battery inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process
Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries
Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA Unicomp AX9100max X-ray Machine The AX9100max is a high-performance X-ray inspection system specially designed for IGBT inspection and other advanced applications. It is widely used across multiple industries, including: Semiconductors: BGA, CSP, Flip Chip, Diode, IGBT Electronics: LED, PCB, Fuse, Connector Modules, Cables Energy & Power
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
Σε απευθείας σύνδεση ανιχνευτής 130kv εξοπλισμού FPD επιθεώρησης ακτίνας X ADR λουρίδων των οδηγήσεων υψηλής ταχύτητας
Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Ανιχνευτής AX8200 ακτίνας X σωλήνων 100KV Finefocus για την επιθεώρηση PCBA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
Σύστημα ακτινογραφίας ακτίνων Χ CX3000 επιφάνειας εργασίας με δυνατότητα R2R για ακριβείς εφαρμογές PCBA και SMT
Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive FEATURES of Desktop X-ray machine 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with a high resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area is easily positioned by an external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock, and emergency button.
Σύστημα ακτινογραφίας Unicomp AX9100max για την επιθεώρηση εσωτερικών ελαττωμάτων ηλεκτρονικών εξαρτημάτων
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
