pcb inspection system
"
Ανιχνευτής 90KV AX8200 ασφάλειας ακτίνας X Unicomp για την ακουστική επιθεώρηση ατέλειας
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200ApplicationsBGA InspectionInspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
220VAC CNC προγραμματίσημη μηχανή 5um 90kV AX8200 ακτίνας X ηλεκτρονικής
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection Item Definition Specs System Parameters Size 1080(L
προγραμματίσημη μηχανή AX8200MAX ακτίνας X 90kV 5um CNC για QFN CSP
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600x Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area 435mm x 385mm X-ray Leakage < 1uSv/h OUR SERVICE
Η σφραγισμένη επίδειξη AX8200MAX 1.0kW ακτίνας X LCD Unicomp σωλήνων επιθεωρεί τη φλεβική Indwelling βελόνα
Discovering how the Unicomp AX8200Max X-ray machine to inspect medical venous indwelling needle qualtiy issue Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
Συγκόλληση πλεξούδας καλωδίων BGA μηχανή ακτίνων X 2.5D Micro Focus Inspection AX8200MAX
Wire Harness Welding Quality Inspection by 2.5D micro focus X Ray Machine AX8200MAX Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive
Εξοπλισμός 220AC/50Hz ακτίνας X Unicomp γραφείου με το σύστημα επεξεργασίας εικόνας DXI
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Ηλεκτρονική μηχανή ελέγχου ακτίνων Χ AX7900 Unicomp 5μm Micro Focus Αυτοαπογνώριση κενού BGA Solder υψηλής ακρίβειας
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
Σε μη απευθείας σύνδεση μηχανή 100kv ακτίνας X FPD Unicomp AX8200B για το ιονικό κύτταρο λι
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
Μηχανή Unicomp σε μη απευθείας σύνδεση πρότυπο AX8200B ανιχνευτών ακτίνας X μπαταριών λίθιου CSP
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
