x ray machine for manufacturing
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Μηχανή 0.8kW επιθεώρησης ακτίνας X φωτισμού των οδηγήσεων οχημάτων για τον ποιοτικό έλεγχο συγκόλλησης
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
Μηχανή επιθεώρησης ακτίνας X HD BGA για τα ηλεκτρονικά και ηλεκτρικά συστατικά
BGA X-Ray Inspection Machine for Electronic and electrical components Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
Υψηλή ακρίβεια κίνησης 90kV σφραγισμένο σωλήνα MOSFET Ημιαγωγός Συστατικό Εξοπλισμός ακτινογραφίας AX7900 Ελέγχος ποιότητας Unicomp
Electronic Semiconductor X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is an advanced micro-focus X-ray NDT system manufactured by UNICOMP Technology.It delivers ultra-clear internal defect imaging for semiconductor packaging, SMT assembly and electronic component quality inspection.Adopting independently manufactured X-ray tubes and professional image analysis software, it effectively inspects solder voids, welding defects, PCB internal layers, battery cells and precision
Γραμμικός ανιχνευτής σειράς επιθεώρησης μηχανών PCBA BGA ακτίνας X Unicomp ανίχνευσης SMT EMS
High Resolution Digital SMT EMS Detection X Ray Machine PCBA / BGA Inspection Linear Array Detector Specifications Operation System Windows Operation System 22" LCD Monitor Keyboard and Mouse X-Ray Machine Dimensions:1080(W)X1180(D)X1730(H) Packing Size:1420*1420*2000mm Weight: 1150KG Magnification:600X Power Requirements:220VAC 50Hz Temperature/Humidity:0℃～ 40℃ / 30 ～ 70RH Power Consuption(Max):0.5KW X-Ray Tube Voltage : 100KV Max Current: 200 μA Focal Spot Size: 5 micron
Μετρητής τμημάτων ακτίνας X ακρίβειας πάνω από 99,99% για τη διαχείριση καταλόγων αποθηκών εμπορευμάτων SMT EMS
Over 99.99% Accuracy X-ray Component Counter for SMT EMS warehouse inventory management Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC,
Πλήρως αυτόματος μετρητής τσιπ ακτίνας X SMD για όλη τη σειρά του εξελίκτρου, του δίσκου JEDEC και των μερών σωλήνων με τη σύνδεση cErp MES
Fully automatic SMD X Ray Chip Counter for all range of reel, JEDEC Tray and tube parts with ERP MES connection Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating
Αυτοκινητοβιομηχανίας NDT ακτίνας X μη καταστρεπτικά εξεταστικά μακρά ζωή καθορισμού εξοπλισμού υψηλά
Non-Destructive Testing (NDT) servicing the requirements of the auto industry ●Strong penetration,high reliable,low breakdown, long life; ●High definition,resolution FPD; ●Multi-functional workstation,360°rotation and shift; ●High automation,fast detection speed; ●User friendly software design for interfacing and to facilitate,customize software function development requirement. For over 15 years X-Ray inspecting, a division of X-Ray industries, has been committed to
Η ρίψη αργιλίου του σε απευθείας σύνδεση NDT Radiograpy ροδών συστήματος ακτίνας X πλαισίων για το πορώδες, ρωγμή ραγίζει την ανίχνευση
Inline X-Ray Testing & Inspection Equipment & Systems for wheel hub Unicomp Technologies is a global supplier of innovative solutions for x-ray inspection and non-destructive testing (NDT). The unicomp systems are based on leading-edge x-ray and vision technology and ensure the fulfilment of customers' quality requirements. Unicomp Technologies’ product portfolio encompasses real-time failure analysis, including standardised systems for manual and automatic x-ray inspection,
