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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Βασικές Ιδιότητες
Τόπος καταγωγής: Κίνα
Επωνυμία Μάρκας: UNICOMP
Πιστοποίηση: CE, FDA
Αριθμός μοντέλου: AX9100max
Εμπορικά Ακίνητα
Ελάχιστη ποσότητα παραγγελίας: 1 σετ
Τιμή: can negotiate
Όροι πληρωμής: L/C,T/T
Δυνατότητα Προμήθειας: 100set/montrh
Σύνοψη του προϊόντος
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...

Λεπτομέρειες προϊόντος

Επισημαίνω:

Unicomp AX9100max X-ray inspection system

,

Flip-Chip BGA X-ray machine

,

FCBGA packaging analysis equipment

Monitor: Οθόνη 27" HD
System OS: Windows 10 64-bit
Hard Disk: 1TB
RAM: 16G
CPU Model: I7
Περιγραφή προϊόντος
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
  • BGA/CSP/Flip Chip packaging
  • LED & optoelectronic components
  • Fuse & diode manufacturing
  • PCB & semiconductor assembly
  • Battery production
  • Small metal castings
  • Electronic connector modules & cables
  • Photovoltaic (PV) cell inspection
Application Fields
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 0
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 1
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 2
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 3
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 4
Dimensions and appearance of Unicomp AX9100max X-ray Machine
Συνολική αξιολόγηση
5.0
★★★★★
★★★★★
Με βάση 50 πρόσφατες αναθεωρήσεις
πέντε αστέρων
100%
4 αστέρων
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3 αστέρι
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2 αστέρια
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1 αστέρι
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Όλες οι κριτικές
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
  • M
    M*k
    Albania Dec 3.2025
    ★★★★★
    ★★★★★
    good machine
  • P
    Peter
    France Feb 20.2025
    ★★★★★
    ★★★★★
    good product
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