industrial x ray systems
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Συγκόλληση ποιότητας/λουρίδων των κενών ρωγμών ανίχνευσης Unicomp οδηγήσεων ακτίνας X για τη βιομηχανία ηλεκτρονικής
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Modular design with In-line expansibility. ● Economical and Practical. ● 100KV 5μm X-Ray tube. ● FPD Detector. ● Real-time image. ● 1000X system magnification. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● Aluminum Die Casting, Moulding Plastic. ● Ceramics, Other Special Industries. ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor
μηχανή Unicomp AX8500 ακτίνας X 2.5D 110kv για την ποιότητα Semicon leadframe που ελέγχει με την αυτόματη μέτρηση
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Μηχανή 22 ακτίνας X ηλεκτρονικής κενών 90kV 8W υπολογιστών γραφείου BGA» LCD
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22" LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
Τοπ μηχανή 5µm επιθεώρησης ακτίνας X κενών 0.5kW 90kV συγκόλλησης πάγκων
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic, Ceramics, other special industries. Features 90kV 5µm closed X-ray tube High resolution FPD with 3-axis motion system, meet basic inspection demands Navigation in windows, target tracking conveniently Max. loading area 235mm×205mm mm, max. inspection area 165mm×190mm, with
Φορητή μηχανή επιθεώρησης ακτίνας X 1uSv/h 90kV 0.5kW για PCBA
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
μηχανή 5μm ακτίνας X υπολογιστών γραφείου 1uSv/h 0.5kW για τους πίνακες PCBA
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
μηχανή 1uSv/h ανίχνευσης ακτίνας X 5µm 0.5kW για το εργαστήριο
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Features 90kV 5µm closed X-ray tube Max. loading area 235mm×205mm mm, max. inspection area 165mm×190mm, with 200X Magnification High resolution FPD with 3-axis motion system, meet basic inspection demands Navigation in windows, target
Υψηλή μηχανή Microfocus επιθεώρησης ακτίνας X συγκόλλησης Unicomp ανάλυσης εικόνας ολοκληρωμένου κυκλώματος
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
SMT BGA που συγκολλά την κενή μηχανή Microfocus 130kV ακτίνας X μέτρησης
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One
