industrial x ray systems
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Στενή ακτίνα X AX9100 130kV Unicomp σωλήνων για τα τμήματα ηλεκτρονικής
130kV close tube X-ray Equipment AX9100 with high resolution FPD for electronics components couterfeit inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
Υψηλή ενίσχυση Microfocus AX9100 130KV ακτίνας X Unicomp ημιαγωγών ολοκληρωμένου κυκλώματος
Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
εξοπλισμός CNC ακτίνας X 5um SMT προγραμματίσημος για τα κενά EMS BGA
5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Μηχανή 110kV Unicomp AX8500 ακτίνας X ηλεκτρονικής CSP SMT για SMT PCBA BGA QFN
Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
1.6kW μηχανή 130kV AX9100 ακτίνας X ηλεκτρονικής για το κενό συγκόλλησης QFN των οδηγήσεων SMT
130kV Microfocus AX9100 X Ray For SMT LED QFN soldering void automatic mapping and measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition
QFN των οδηγήσεων μηχανών SMT PCBA BGA ακτίνας X Unicomp AX9100 που συγκολλά την κενή μέτρηση
SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ●
ακτίνα X AX9100 130kV Microfocus Unicomp για τη μέτρηση κενών BGA QFN των οδηγήσεων SMT
130kV Microfocus X Ray Inspection Machine Unicomp AX9100 For SMT LED BGA QFN Voids measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition
Κλειστό τσιπ AX8500 κτυπήματος σωλήνων ακτίνας X των οδηγήσεων CSP μηχανή για τον ημιαγωγό 100KV
Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Ενίσχυση Unicomp AX8500 μηχανών FPD 1000X ακτίνας X ηλεκτρονικής SMT BGA
Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel
