electronics x ray system
"
Συγκολλώντας κενός εξοπλισμός επιθεώρησης NDT των οδηγήσεων μηχανών BGA QFN ακτίνας X ηλεκτρονικής PCB EMS SMT
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, ...
2.5D περιστροφή 360° μηχανών 40W ακτίνας X ηλεκτρονικής τίτλου με το Κίνημα 6 άξονα
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation ...
Εσωτερικός έλεγχος ατελειών ηλεκτρονικής συστημάτων SMT ακτίνας X ηλεκτρονικής εστίασης μικροϋπολογιστών
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area ...
Μηχανή 1.0kW ακτίνας X ηλεκτρονικής αλγορίθμου FPD για την ύλη συγκολλήσεως επανακυκλοφορίας των οδηγήσεων
Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables...
Ηλεκτρονική μηχανή ακτίνων Χ AX9100MAX με γωνία κλίσης 60° για τη μέτρηση καμπυλότητας IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
Υψηλό σύστημα ακτίνας X ηλεκτρονικής ενίσχυσης για την κενή επιθεώρηση BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area ...
CNC προγραμματίσημη εσωτερική ποιοτική επιθεώρηση σφαιρών γκολφ μηχανών ακτίνας X ηλεκτρονικής ανίχνευσης
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...
Πολυ - υψηλή ταχύτητα μηχανών ακτίνας X ηλεκτρονικής λειτουργίας πραγματική - χρόνος για τη χρυσή σφαίρα
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
Σφαίρα γκολφ μηχανών ακτίνας X ηλεκτρονικής επιθεώρησης PCB BGA μέσα στον ποιοτικό έλεγχο
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area ...
