electronics x ray system
"
Μηχανή ακτίνας X Benchtop Unicomp/μηχανή ακτίνας X ηλεκτρονικής για τα εργαστήρια ανάλυσης αποτυχίας
Benchtop Electronics X-ray Machine for failure analysis laboratories Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
110KV υψηλής ανάλυσης ακτίνων Χ Unicomp AX8300 για μη καταστροφική ανάλυση αρθρώσεων συγκόλλησης BGA
High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips and solder joints. Our Service Commitment Response to inquiries within 12 hours Direct manufacturer pricing with competitive rates Comprehensive one-year warranty with free
AX7900 πραγματικός - μηχανή χρονικής ψηφιακή ακτίνας X για την εσωτερική επιθεώρηση ατέλειας ηλεκτρονικής
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
AX7900 πραγματικός - μηχανή χρονικής αυτόματη σε μη απευθείας σύνδεση ακτίνας X για την εσωτερική επιθεώρηση ατέλειας ηλεκτρονικής
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
Η συσκευή ελέγχου ακτίνων Χ της Unicomp 5μm Micro Focus υψηλής ακρίβειας PCBA IC Electronics AX7900
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Ημιαγωγός ηλεκτρονικής SMT BGA εξοπλισμού ανίχνευσης ακτίνας X υψηλής δύναμης
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
AX7900 μηχανή επιθεώρησης ακτίνας X συνδετήρων των οδηγήσεων ολοκληρωμένου κυκλώματος, ψηφιακή μηχανή ακτίνας X ηλεκτρονικής
AX7900 IC LED Clips X-ray Inspection Machine Electronic Components Detector Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max.
Μηχανή 22 επιθεώρησης ακτίνας X υψηλής ακρίβειας» εφαρμογή βιομηχανίας ηλεκτρονικής οργάνων ελέγχου LCD
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Στενή ακτίνα X AX9100 130kV Unicomp σωλήνων για τα τμήματα ηλεκτρονικής
130kV close tube X-ray Equipment AX9100 with high resolution FPD for electronics components couterfeit inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
