electronics x ray system
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AX7900 μηχανή ακτίνας X ηλεκτρονικής για την αυτοκίνητη ενότητα ανελκυστήρων γυαλιού
AX7900 Electronics X Ray Machine For Automotive Glass Lift Module Using Unicomp AX7900 X-ray machine for automotive glass lift module wire harness inner broken Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size
Μηχανή 1.3kW ακτίνας X ηλεκτρονικής HD FPD για τα τσιπ ολοκληρωμένου κυκλώματος Semicon
HD FPD Electronics X Ray Machine 1.3kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm
Ανιχνευτής Unicomp μηχανών 90kV FPD ακτίνας X ηλεκτρονικής EMS SMT
EMS SMT Electronics X Ray Machine 90kV FPD Detector Unicomp Original manufacturer SMT Equipment Electronics X Ray Machine on IC chips wire Analysis Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging
Μηχανή 22 ακτίνας X ηλεκτρονικής κενών 90kV 8W υπολογιστών γραφείου BGA» LCD
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22" LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
Μηχανή ακτίνας X ηλεκτρονικής BGA 90kV για την ηλιακή φωτοβολταϊκή συγκόλληση
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Μηχανή 100KV ακτίνας X ηλεκτρονικής CSP AX8200 για τη συγκόλληση ηλιακών κυττάρων
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
220VAC CNC προγραμματίσημη μηχανή 5um 90kV AX8200 ακτίνας X ηλεκτρονικής
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection Item Definition Specs System Parameters Size 1080(L
100KV μηχανή 0.8kW ακτίνας X ηλεκτρονικής για τη συγκόλληση επανακυκλοφορίας PCBA
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Μηχανή UNICOMP CX3000 ακτίνας X ηλεκτρονικής CSP για το συνδετήρα καλωδίων
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
