bga x ray inspection system
"
μηχανή 1.0KW ανίχνευσης ακτίνας X 100kV 1uSv/h για τη συγκόλληση των οδηγήσεων
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel X-Ray tube & Detector motion up and down, friendly user interface and fast target point
Συγκολλώντας εξοπλισμός 24 ανίχνευσης ακτίνας X 1kW 90KV οδηγήσεων»
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
μηχανή ανίχνευσης ακτίνας X 1kW 1uSv/H 90KV για το φωτισμό των οδηγήσεων
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
Μηχανή ακτινογραφίας υψηλής μεγέθυνσης Unicomp AX7900 για έλεγχο ποιότητας μεταχειρισμένων κινητών τηλεφώνων
High magnifications X-ray machine Unicomp AX7900 for used mobile phone quality inspection Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming Automatic
SMT PCB Μηχανή ακτινογραφίας υψηλής ανάλυσης Μικρόνια Στόχος Σημείο Μεγέθους Unicomp AX7900 Για κινητό τηλέφωνο Εσωτερική ποιότητα και ρήξεις Επιθεώρηση
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
Η Unicomp AX7900 High Specifications 2D 2.5D X-Ray Machine για επιθεώρηση κινητών τηλεφώνων και έλεγχο ρωγμών
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking Description of IC X Ray machine AX7900: It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A
3.5kW ευθύγραμμο σύστημα ανίχνευσης ADR μηχανών ακτίνας X φραγμών των οδηγήσεων για την εσωτερική ποιοτική επιθεώρηση
LED bar Inline X-Ray ADR Detection System for Inside Quality Inspection Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell The Unicomp AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields diagram of Unicomp X-ray AX9100max Functions and Features Functions and features diagram of Unicomp X-ray AX9100max
90KV Micron Focus Spot Size Tube X-Ray Machine Unicomp Αναβαθμισμένο μοντέλο AX7900 με διπλό υπολογιστή για τον έλεγχο της ποιότητας του κινητού τηλεφώνου
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
