bga x ray inspection system
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Μηχανή Unicomp AX8200B ακτίνας X ηλεκτρονικής μπαταριών λίθιου
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
22» μηχανή ακτίνας X ηλεκτρονικής Unicomp AX8200B για την μπαταρία πολυμερούς λίθιου
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes
Μηχανή σάρωσης ακτίνων Χ 4 άξονων Unicomp AX8200B Για Καθοδική μπαταρία λιθίου
AX8200B X-Ray machine for cylindrical lithium battery CNC programmable inspection with auto measurement Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X
Unicomp AX8200 με τη μηχανή ακτίνας X PCB FPD 100kv για την ποιοτική δοκιμή PCBA
Unicomp AX8200 automated smt pcb xray machine for computer motherboard repair The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Μηχανή 1.0kW ακτίνας X ηλεκτρονικής αλγορίθμου FPD για την ύλη συγκολλήσεως επανακυκλοφορίας των οδηγήσεων
Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
Ευπροσάρμοστο σύστημα μηχανών ακτίνας X ηλεκτρονικής εναλλασσόμενου ρεύματος 110-220V για το τσιπ κτυπήματος, ΣΠΆΔΙΚΑΣ
Electronics X Ray Machine for BGA , CSP , LED , Flip Chip , Semiconductor OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you. 6
Μηχανή ακτινοβολίας ακτινοβολίας σωλήνα μεγέθους σημείου εστίασης 130KV AX9100MAX με διπλό υπολογιστή για επιθεώρηση PCB & BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Μηχανή ακτινοβολίας 130KV μικροφωκόστρου μεγέθους εστίασης μικροφωκόστρου Unicomp AX9100 Αναβαθμισμένο μοντέλο AX9100MAX με διπλό υπολογιστή για επιθεώρηση PCB & BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Μηχανή ακτίνας X ηλεκτρονικής καμερών BGA QFN DFN CCD
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector FPD Active Area: 130mm*130mm Resolution 58 LP/cm Camera 2 Mega Pixel CCD Motion range (Up and Down) 290mm
