x ray machine for manufacturing
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Τσιπ αντίθετο 1.1kW ακτίνας X συστημάτων SMD cErp με το εξέλικτρο ταινιών 4
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Αντίθετο 440mm ακτίνας X Unicomp SMD PCBA όργανο ελέγχου σηράγγων LCD τσιπ
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Ενεργός χώρος ανίχνευσης 129x129mm Εξοπλισμός ελέγχου ακτίνων Χ για ηλεκτρικό ξυράφι 1280x1220x1615mm
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It finds extensive application in numerous domains, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small-scale metal casting, electronic connector modules, cables, aerospace components, and the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A Large-Scale Laser Pinpoint Inspection Table for Accurate Localization
Εξοπλισμός ελέγχου ακτινογραφίας μεγέθους εστίασης 5μm για PCBA 1100kg χωρητικότητα
X-Ray Inspection Equipment for PCBA Description of IC X Ray machine AX7900: It is widely employed across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC
Υψηλός καθορισμός πραγματικός - εξοπλισμός UNI160-Y2-D9 χρονικής ακτίνας X για τη βιομηχανία αεροσκαφών
Unicomp Inline Wheel Hub NDT X-ray Inspection System workshop UNI160-Y2-D9 Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. Technical parameter Inspection range:13"-22" ; 14"- 26"wheel hubs Inspection speed:≤35
Ενιαία σφαίρα 40-120kV ανοξείδωτου ακτίνας X Unicomp ακτίνων με το λογισμικό
Max Voltage: 40-120kV Max Current: 0.2-7.5mA Dimension(WxDxH,mm): 1600x790x1800 Weight: 500kg Inspection Accuracy(mm): Stainless Steel Ball ø0.5,Stainless Steel Wire 0.2x1.5, Glass2.0,Plastic 1.5 Safety:
Μηχανή ακτινοβολίας 160KV NDT Unicomp UNC450 Για μη καταστροφικές δοκιμές κυλίνδρων, χύτευσης μετάλλων, αεροδιαστημικών εξαρτημάτων
160KV NDT Xray machine Unicomp UNC450 for cylinder,metal castings, aerospace parts non-destructive testing Product Description: The specialized equipment serves as a cornerstone for non-destructive testing across a vast array of materials and products. It is extensively employed to scrutinize metal castings, verifying the structural integrity of intricate metal components. Moreover, it covers a wide spectrum of hardware products, from basic nuts and bolts to intricately
10-50m/ Ελάχιστοι τρόφιμα Unicomp και εξοπλισμός ακτίνας X ποτών για την αξιόπιστη ανίχνευση
Unicomp X-ray inspection systems for dependable detection of foreign material Unicomp X-ray inspection system scans for contaminants and checks for foreign bodies in dry bulk powders, baking and snack products, cereal and crackers. It detects and automatically rejects contaminants, including glass shards, metal fragments, mineral stone, and some plastic and rubber compounds. The system includes software that collects data that can be stored centrally and used with optional
Ημιαγωγός ηλεκτρονικής SMT BGA εξοπλισμού ανίχνευσης ακτίνας X υψηλής δύναμης
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
