x ray machine for manufacturing
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Ένωση του κοινού ανιχνευτή ρωγμών ακτίνας X δοκιμής με ανοδικό να στηρίξει, ξύλινη συσκευασία περίπτωσης
Welding Joint Test Machine X Ray Flaw Detector Unicomp Installed in Kenya Paneramic radiation NDT X Ray Equipment with ripple ceramic x-ray tube plays important parts in carrying on nondestructive examination for nonmetallic, light metal, casting, various alloys and pressure vessels etc, mainly detecting weld defects ,such as crack, blowhole, entrapped slag, incomplete fusion ,blowhole,bubble etc ,also using for shipbuilding ,airplane and national defense etc industry field
ηλεκτρονική Unicomp συστημάτων επιθεώρησης ακτίνας X 100kV PCBA για το κενό BGA/συγκόλληση
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector Intensifier 4”/2” (FPD Optional) Resolution 77/110 LP/cm Camera 200 Mega Pixel CCD Motion range (Up and Down) 290mm System Operating System Industrial PC, Win 7, i7
Ανιχνευτής ψηφίσματος FPD εξοπλισμού επιθεώρησης εναλλασσόμενου ρεύματος 110~220V Bga γεια για SMT βιομηχανικό
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
Εξοπλισμός 22 ακτίνας X επιθεώρησης BGA» LCD με CNC την προγραμματίσημη λειτουργία ανίχνευσης
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient
Υψηλή μηχανή Microfocus επιθεώρησης ακτίνας X συγκόλλησης Unicomp ανάλυσης εικόνας ολοκληρωμένου κυκλώματος
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Αντίθετο 440mm ακτίνας X επιθεώρησης SMT BGA CE σηράγγων τσιπ
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Καταλόγων μετρώντας ακτίνας X τσιπ κτυπήματος τσιπ αντίθετο για τα τμήματα ηλεκτρονικής
High precision SMD X-Ray chip counter Unicomp CX7000L for electronics components inventory counting Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast
Αντίθετη σήραγγα Unicomp CX7000L 440mm τσιπ ακτίνας X ηλεκτρονικής SMT PCBA
Factory directly supply of SMD Xray Chip counter Unicomp CX7000L for SMT and PCBA electronics compamy Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
Τσιπ αντίθετο CX7000L 1.1kW ακτίνας X SMD με την ολοκλήρωση βάσεων δεδομένων αποθηκών εμπορευμάτων cErp MES
Unicomp CX7000L X-ray for SMD Chip Counter with ERP MES warehouse database integration Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows
