x ray equipment
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Επιθεώρηση ακτίνων Χ Unicomp 110KV για ανίχνευση κενών MOSFET και ανάλυση αξιοπιστίας AX8300MAX
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
μηχανή Unicomp 110 ακτίνας X μπαταριών λίθιου μεγέθους σημείων 15μm ψήφισμα LP/CM
Unicomp Lithium Battery Online X-Ray Inspection System, Compatible with Battery Production Line Specifications: System Parameters Dimension(L×W×H) 3300mmX1500mmX2000mm Weight 2.5t Working Environment 0～40℃ Power 4KW Accuracy ±60μm Operating Mode In-line X-ray Tube Type Closed Max.Voltage 110kv Max.Current 0.45mA Focal Spot Size 15um Image Detector Type Image Intensifier Resolution 110 Lp/cm Size 4” Applied to 18650 Cylindrical Battery Max.Capacity 60ppm/130ppm Operation Ratio
110kV Σφραγισμένος σωλήνας Υψηλής Ακρίβειας IC Εξοπλισμός ακτίνων Χ ΑΧ8300MAX Unicomp Έλεγχος ποιότητας
110kV Sealed Tube High Precision IC Semiconductor Component Xray Equipment AX8300MAX Unicomp Quality Control Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual
Unicomp UNCT3200 320kV Βιομηχανικό σύστημα CT για την επιθεώρηση λεπίδων κινητήρα
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Key Specifications Attribute Value Maximum tube voltage 320kV Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing equipment features a vertical dual-column structural design with a high-precision, solid marble base. Equipped with a high-energy split X-ray tube and large-format flat-panel detector, this
Ευθύγραμμος αποτελεσματικός πραγματικός συστημάτων επιθεώρησης ακτίνας X δοκιμής συγκομιδών μη καταστρεπτικός - χρόνος για τα ξένα υλικά
Inline Crop NDT X Ray System , Effective Foreign Materials Real-time Detector Product Feature Flexibility Tooling and Fixture Easy to Operate, User-friendly Software Design Customized to Provide Solutions After-sales Service of Entire Network Low Cost of Testing Service Inspection Image:
Μηχανή AX8200MAX ακτίνας X υψηλής ανάλυσης για την εσωτερική επιθεώρηση ατελειών τσιπ Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
Ακτίνα X της Κίνας Unicomp 90KV με το σύστημα επιθεώρησης HD PFD για την ανίχνευση ατελειών Chipset
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
Ανθεκτικός μετρητής τσιπ ακτίνας X, τμήμα μηχανών ακτίνας X ηλεκτρονικής που μετρά τη βιομηχανία 4,0 καταλόγων EMS
SMD Chip Electronic Component Unicomp X ray Counter Inspection System This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the classifica
Αντίθετος BGA μικροϋπολογιστής BGA μηχανών επιθεώρησης ακτίνας X τσιπ στην ανάλυση μπριζολών
Chip Counter BGA X Ray Inspection Machine Micro BGA on chop analysis X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to
