x ray detection systems
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QFN των οδηγήσεων μηχανών SMT PCBA BGA ακτίνας X Unicomp AX9100 που συγκολλά την κενή μέτρηση
SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ●
ακτίνα X AX9100 130kV Microfocus Unicomp για τη μέτρηση κενών BGA QFN των οδηγήσεων SMT
130kV Microfocus X Ray Inspection Machine Unicomp AX9100 For SMT LED BGA QFN Voids measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition
10 NDT KW εξοπλισμού ακτίνας X για τις ατέλειες Heatsinks ρίψης/τα καυτά δάκρυα/την κρύα ροή
Casting defects heat sinks, hot tears, cold-flow, drag-marks, missing material and cracks NDT X-Ray Inspection Application Fields of X Ray Machine UNZ-450 ● Engineering components ● Small aluminum castings, iron castings ● Auto parts, metal products Technical Parameters and Specifications of X Ray Machine UNZ-450 System Parameters Dimensions 2766mm*2813mm*2598mm(L*W*H) Equipment weight 17.5T Power 10 kW Maximum penetration (FE) 80 mm Detection range Φ550*200mm Load weight
Σύστημα επιθεώρησης ακτίνων Χ 90KV FPD πιστοποιημένο CE/FDA για την ανίχνευση ελαττωμάτων πυκνωτών
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
AX7900 μηχανή επιθεώρησης ακτίνας X συνδετήρων των οδηγήσεων ολοκληρωμένου κυκλώματος, ψηφιακή μηχανή ακτίνας X ηλεκτρονικής
AX7900 IC LED Clips X-ray Inspection Machine Electronic Components Detector Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max.
Χαμηλή διακοπής 225KV NDT ακτίνας X επιθεώρηση σκαφών αεροσκαφών μηχανών αυτοκίνητη
Unicomp X ray NDT Machine Automotive Aircraft Vessel Inspection Systems UNC225π Features: ● High reliable and long life,low breakdown ● High definition and resolution FPD ● C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend) ● Multi-functional workstation,360°rotation and shift ● User friendly software design for easy interfacing can facilitate,customized software ● High penetration,Voltage up to 225KV,Maximum penetration thickness up
Μηχανή επιθεώρησης ακτίνας X ηλεκτρονικών συστατικών BGA
Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids,
Σύστημα επιθεώρησης ακτίνας X BGA, υψηλότερη κάλυψη δοκιμής μηχανών επιθεώρησης PCB ακτίνας X
SMT , BGA , CSP , Flip Chip , LED BGA X Ray Inspection Machine Unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage
Βιομηχανικό σύστημα 80kV απεικόνισης ακτίνας X/πηγή 90kV με Submicron το εστιακό μέγεθος σημείων
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size FEATURES: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x 380mm,
