industrial x ray systems
"
Κύριος κατασκευαστής της Κίνας της μηχανής ακτίνας X ακτινογραφιών NDT για την ποιοτική επιθεώρηση ρωγμών συγκόλλησης σωλήνων
160kV Digital Radiography Industrial NDT X-Ray inspection machine UNC160S for foundry castings non-destructive testing Our goal is to solve inspection problems with tailored systems, while guaranteeing a premium post-sales service. More than 15 years of expertise in industrial (NDT) and electronics applications combined with experienced engineers result in solutions that set new industry standards. Discover the invisible! 1. All Unicomp x-ray systems have CE approval. 2.
Πραγματικός - χρονικής NDT ακτίνας X εξοπλισμού unc160-γ-λ γενική ανίχνευση αυτόματης θέσης χρησιμοποίησης ευθύγραμμη
General Utilization Inline NDT Real time UNC160-C-L with outstanding image quality FEATURES: * The implementation of automatic location detection * Automatic identification of defect detection * The unqualified product identification marking * OK and NG are sorting and recognition * High contrast, high quality image detection * Extended-modular design, strong, automatic loading and unloading * Adopt the design of transmission mechanism of high speed positioning, multi axis
HD ακτίνα X 130kV Unicomp καμερών για την επιθεώρηση των πινάκων PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
Μηχανή ακτίνας X microfocus Unicomp AX8200MAX 5um για την αυτοκίνητη PCBA BGA QFN CSP επιθεώρηση ατελειών συγκόλλησης EMS
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
αυτόματη μηχανή 120kv 210W Unicomp επιθεώρησης ακτίνας X τροφίμων
Automatic Food X Ray Inspection Machine 120kv 210W Unicomp Unicomp factory supply X-ray inspection machine for food foreign objects contamination Technical Specifications of Food Xray machine Equipment Features Dimension 1168(W)X985(D)X1510(H)mm Machine weight 500kg X-ray tube 80-120kv/210-480W Power Supply AC 110/220V, 50/60Hz Max. Loading weight 10kg X-ray detector Diode array with 0.4mm resolution Channel size 400mm(W)*150mm(H) Conveyor Speed 10-60M/min Heavy load Conveyor
Μηχανή ακτινογραφίας υψηλής μεγέθυνσης Unicomp AX7900 για έλεγχο ποιότητας μεταχειρισμένων κινητών τηλεφώνων
High magnifications X-ray machine Unicomp AX7900 for used mobile phone quality inspection Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming Automatic
Ηλεκτρονική μηχανή ακτινοβολίας Unicomp AX7900 με γωνία κλίσης 60°
CNC programable automatic inspection Electronics X-ray machine Unicomp AX7900 with tilting angle 60°for used phone inspection Description of IC X Ray machine AX7900: It is broadly utilized in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpoint
SMT PCB Μηχανή ακτινογραφίας υψηλής ανάλυσης Μικρόνια Στόχος Σημείο Μεγέθους Unicomp AX7900 Για κινητό τηλέφωνο Εσωτερική ποιότητα και ρήξεις Επιθεώρηση
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
Εξοπλισμός ελέγχου ακτίνων Χ με μεγέθυνση συστήματος 600X για ηλεκτρικό ξυράφι με μέγεθος pixel 85μm
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It is broadly utilized in various sectors such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small-scale Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, and more. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC Programming
