industrial inspection systems
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Εξοπλισμός επιθεώρησης ακτίνας X Unicomp 320kV NDT για τη ρίψη σιδήρου αργιλίου
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System Resolution: ~5 microns 50cm diameter x 80cm tall nominal part envelope Comprehensive acquisition,
Σύστημα επιθεώρησης CT 3D ακτίνων Χ εκτός σύνδεσης Unicomp AX9500 για επιθεώρηση επιπέδων PCB
3D X-Ray computed temography offline CT Inspection system unicomp AX9500 for PCB layers inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum die-casting
Μηχανή ψηφιακών ακτίνων Χ σε πραγματικό χρόνο AX7900 για την επιθεώρηση εσωτερικών ελαττωμάτων πυκνωτών
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
Εξοπλισμός ελέγχου με ακτίνες Χ για PCB με κατανάλωση ισχύος 1,0 kW 1280 L x 1220 W x 1615 H mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Inspection Table of Large Dimensions, Laser Pinpointing for Exact Positioning Precise Control
UNC160 αυτοκίνητη αυτοματοποίηση αεροπορίας μηχανών επιθεώρησης ακτίνας X μερών
UNC160 Automotive Parts X-ray Inspection Equipment Aviation Automation Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. Applications: ● Cast parts and pressure Vessels ● Wheel,Tires and Metal parts ● Steel pipe
Συμπαγές σύστημα γραφείου ακτίνας X NDT, βιομηχανικές λύσεις συστημάτων επιθεώρησης
Compact NDT X-ray Cabinet Equipment China Industrial Inspection Solutions The main focus of this compact X-ray cabinet for manual real-time inspection are sample parts. The goal is to achieve the same brilliant image quality for a budget price by reducing the comfort items and advanced features of the UNC130. This leads to the best cost-benefit ratio for our customers on the market. X-ray inspection is a necessary requirement to meet modern day production standards. For many
Σύστημα ακτίνας X καλωδίων SMD, εξοπλισμός AX8300 επιθεώρησης PCB για τα τμήματα ηλεκτρονικής
SMD Cable Electronics Components Unicomp PCB X Ray Machine AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Features: 110kV Microfocus x-ray source, High resolution FPD X/Y/Z/Tilt Motions (table, tube, FPD) 360° Table Rotation Angle View up to 70 Degrees
Μόνο κενό BGA σύστημα 40W επεξεργασίας εικόνας μηχανών DXI επιθεώρησης ακτίνας X στάσεων
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system,
PCBA που συγκολλά τη υψηλή ταχύτητα μηχανών επιθεώρησης ακτίνας X BGA με το μεγάλο πίνακα δειγμάτων
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
