bga x ray machine
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2.5D περιστροφή 360° μηχανών 40W ακτίνας X ηλεκτρονικής τίτλου με το Κίνημα 6 άξονα
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point positioning system 130kV (Option 110KV) 7µm closed X-ray tube,
Υψηλή ακτίνα X 130KV Unicomp ενίσχυσης για το αεροδιάστημα αεροπορίας
Aviation, Aerospace and Automotive Connector inside quality checking with High Magnification X-ray machine from Unicomp Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Στενή μηχανή AX9100 ακτίνας X σωλήνων 2.5D για το συγκολλώντας ποιοτικό έλεγχο των οδηγήσεων με τις υψηλές εικόνες resolutin
Close tube 2.5D X-ray Machine AX9100 for LED soldering quality control with high resolutin images Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
Ηλεκτρονική BGA AX8200 μηχανών επιθεώρησης ακτίνας X Unicomp ημιαγωγών EMS
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Στενό σύστημα ακτίνας X σωλήνων AX7900 Unicomp με την άποψη κλίσης FPD για την επιθεώρηση καλωδίων ολοκληρωμένου κυκλώματος SMT EMS BGA & ποιότητας καλωδίων
Unicomp close tube AX7900 X-ray system with FPD tilting view for SMT EMS BGA IC Cable & wires qualtiy inspection Specifications of AX7900 X-ray system: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel
Σύστημα επιθεώρησης 0.8kW BGA ακτίνας X ανιχνευτών Flawer για το λαμπτήρα των οδηγήσεων οχημάτων
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Μηχανή 0.8kW επιθεώρησης ακτίνας X φωτισμού των οδηγήσεων οχημάτων για τον ποιοτικό έλεγχο συγκόλλησης
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Σύστημα επιθεώρησης ακτίνας X AX7900 0.8KW για τη συγκόλληση PCBA BGA CSP QFN
2.5D microfocus AX7900 X-ray Inspection System for PCBA BGA CSP QFN Soldering Void Defect Inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Στενή μηχανή επιθεώρησης PCB ακτίνας X σωλήνων Microfocus 130KV για PCBA των οδηγήσεων SMT BGA CSP
Microfocus 130KV close tube X-ray inspection machine for SMT BGA, CSP, LED, PCBA soldering quality inspection Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of Unicomp AX9100: ● SMT, BGA, CSP, Flip
