bga inspection equipment
"
Ανιχνευτής ψηφίσματος FPD εξοπλισμού επιθεώρησης εναλλασσόμενου ρεύματος 110~220V Bga γεια για SMT βιομηχανικό
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
Μηχανή ακτίνας X ηλεκτρονικής υψηλής επίδοσης, κλειστός τύπος σωλήνων επιθεώρησης BGA εξοπλισμός
Electronic and electrical components BGA X Ray Inspection Machine Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-Ray System Tube Type Closed Voltage/Current 100kv/200μA Focal Spot Size 5μm FPD Detector FPD Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm Weight 1500 kg Power 2kW System Magnification 500 x
Εξοπλισμός επιθεώρησης ακτίνας X BGA Unicomp
High-quality PCB inspection system BGA X Ray Inspection Machine X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7 axis linkage, 70
Unicomp X-ray AX8300MAX Semiconductor Microfocus Εξοπλισμός επιθεώρησης ακτίνων Χ
Unicomp X-ray AX8300MAX Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel 6.
1uSv/H χαρτογράφηση εξοπλισμού BGA CNC επιθεώρησης ακτίνας X μπαταριών λίθιου
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200B The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Σε απευθείας σύνδεση υψηλή ανάλυση μηχανών επιθεώρησης ακτίνας X BGA με την ενσωματωμένη γεννήτρια
Online BGA inspection system with integrated generator X-Ray Inspection Machine OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to customers, with competitive price. 3.We provide one year warranty, free training and whole life technology support. 4.We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5.Well-trained and Professional after-sales service team to support you.
Κλειστή Microfocus επιθεώρηση μηχανών BGA ακτίνας X σωλήνων 90KV
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Επιθεώρηση Unicomp AX8200 BGA μηχανών επιθεώρησης ακτίνας X επίδειξης 1.0kW LCD
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Μόνο κενό BGA σύστημα 40W επεξεργασίας εικόνας μηχανών DXI επιθεώρησης ακτίνας X στάσεων
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system,
