bga inspection equipment
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Μεγάλη μηχανή ακτίνας X σκηνικού PCB επιθεώρησης, έξοχος ευαίσθητος εξοπλισμού επιθεώρησης ακτίνας X
Large inspection stages PCB X Ray Machine with high quality X-ray images Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Item Definition Specs ...
Αντίθετο 440mm ακτίνας X επιθεώρησης SMT BGA CE σηράγγων τσιπ
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage ...
εξοπλισμός επιθεώρησης ακτίνας X 130kV 5μm για τα φω'τα των οδηγήσεων 1.2m
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic ...
Ανιχνευτής ακτίνων Χ με κλίση 110 kV 50° σφραγισμένος σωλήνας AX8300 Unicomp Εξοπλισμός επιθεώρησης κενών αρθρώσεων Crimp
AX8300 110kV Sealed Tube X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly ...
Σε απευθείας σύνδεση ανιχνευτής 130kv εξοπλισμού FPD επιθεώρησης ακτίνας X ADR λουρίδων των οδηγήσεων υψηλής ταχύτητας
Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W ...
Σύστημα μηχανών ακτίνας X ηλεκτρονικής ημιαγωγών EMS για την επιθεώρηση BGA και CSP
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes ...
Ανιχνευτής 130KV τσιπ FPD κτυπήματος εξοπλισμού ανίχνευσης ακτίνας X SMT BGA για Semicon
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...
Εξοπλισμός 22 ακτίνας X επιθεώρησης BGA» LCD με CNC την προγραμματίσημη λειτουργία ανίχνευσης
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC ...
Σφαίρα γκολφ μηχανών ακτίνας X ηλεκτρονικής επιθεώρησης PCB BGA μέσα στον ποιοτικό έλεγχο
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area ...
