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High Precision IC AX8300 Unicomp 5μm Micro Focus 110kV Sealed Tube X-ray Machine

Βασικές Ιδιότητες
Τόπος καταγωγής: Κίνα
Επωνυμία Μάρκας: UNICOMP
Πιστοποίηση: CE, FDA
Αριθμός μοντέλου: AX8300
Εμπορικά Ακίνητα
Ελάχιστη ποσότητα παραγγελίας: 1 σετ
Τιμή: can negotiate
Όροι πληρωμής: T/T,L/C
Δυνατότητα Προμήθειας: 30 σετ ανά μήνα
Σύνοψη του προϊόντος
High Precision IC AX8300 Unicomp 5μm Micro Focus 110kV Sealed Tube X-ray Machine The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro...

Λεπτομέρειες προϊόντος

Επισημαίνω:

High Precision IC X-ray Machine

,

5μm Micro Focus X-ray Machine

,

110kV Sealed Tube X-ray Machine

Machine Type: επιθεώρηση microfocus X-ray
Product Name: AX8300
Dimension: 1215*1325*1700(mm)
Power Supply: 220V,50Hz/60Hz 4A
Weight: 1350 κιλά
Voltage: 110 kV
Warranty: 1 Έτος
Max KV/Type: 110 kV/Σφραγισμένο
Περιγραφή προϊόντος
High Precision IC AX8300 Unicomp 5μm Micro Focus 110kV Sealed Tube X-ray Machine
The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and excessive energy waste of 130kV models.
Integrated with a high-end flat-panel detector (FPD), the AX8300 captures ultra-high-definition, high-magnification images with industry-leading fineness. Supported by a full 360° rotating worktable, the system enables flexible multi-angle observation and comprehensive detection of hidden defects such as BGA voids, solder cracks, welding shortages and internal packaging flaws.
Key Features
  • 110kV Microfocus X-ray source
  • High resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt Motions (table, tube, FPD)
  • 360° Table Rotation
  • Angle View up to 70 Degrees
  • Point and Click Location Navigation
  • CNC Programming for Multiple Image Inspection Routines
  • Maximum Inspection Area: 360 x 340mm
Applications
BGA/CSP/FLIPS CHIP:
Bridging, Voids, Opens, Excessive/Insufficient solder
QFN:
Bridging, Voids, Opens, Registration
SMT Standard Components:
QFP, SOT, SOIC, Chips, Connectors, Others
Semiconductor:
Bond wire, Die attach VOID, MOLD, VOID
Multi-layer Board (MLB):
Inner layer registration, PAD stack, Blind/buried vias
Technical Specifications
ModelAX8300
Max kV/Type110 kV/Sealed
Power Consumption900W
Max. Electron Beam Power25W
Focal Spot Size5μm
Geometric Magnification48.8X
Imaging System (Option)Flat Panel Detector
Door OpenHand-operated door
Monitor27" HD 4K Display
Dimensions1215x1325x1700mm
Weight1350kg
Radiation Safety<1μSv/hr
ControlKeyboard/Mouse/Joystick
Automated InspectionStandard
Primary ApplicationsChip inspection/Electronic components/Auto parts, etc.
Note: Focal spot size is variable. Please consult Unicomp for specific requirements.
X-ray Safety Commitment: All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed 0.5 millirem/hr at 2" from any external surface. Our machines typically emit 15 times less radiation.
Dimensions and Appearance
AX8300 X-ray machine dimensions and physical appearance
Inspection Images
AX8300 X-ray inspection machine sample inspection image showing high-resolution PCB component analysis
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    United States Jan 21.2026
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