x ray inspection system
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99.8% ο μετρητής τσιπ μηχανών ανίχνευσης ακτίνας X Acurracy φορτώνει στο σύστημα cErp MES
Unicomp online X-Ray Chip Counter System, Counting Result Automatic upload to MES ERP System Spcifications: Max.Voltage 100kV Max.Current 3.5mA Spot Size 0.4mm Working Method Automatic inline inspection Imaging system Line scan camera Scanning accuracy >99.8% Scanning size 450 X 80 mm Minimum material size 01005 Display 22'LCD Display Max. inspection speed 0.1m/s Inspection size Φ30-Φ450mm less than 50mm thickness tray Scan height 10mm-60mm Dimensions 5500mm X 1000mm X 2100
Μηχανή ακτίνας X ηλεκτρονικής PCBA 22» LCD 1kW NDT
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function workstation with
Ακτίνα X SMT 1kW 90KV BGA Viods που ανιχνεύει τον εξοπλισμό
Features • Multi-function DXI image processing system, CNC programmable detection • Multi-function workstation with ±60° tilt and X-Y multi-axis movement • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • X-ray tube & detector automatic lifting and descending, with convenient target point positioning system • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification X-ray Images Item Description Specifications X-Ray
Ψηφιακή μηχανή ακτίνας X δεσμών 1kW 90KV καλωδίωσης BGA Viods
Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector FPD Active Area: 130mm*130mm Resolution 58 LP/cm Camera 2 Mega Pixel CCD Motion range (Up and Down) 290mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area
Σύστημα ακτινογραφίας AX9100max με αλγόριθμους για την ανασυγκρότηση εικόνας υπερεκτίμησης
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Ηλεκτρονικά πλαίσια 2D & 2.5D Μηχανή ακτινογραφίας ακτινογραφίας AX9100MAX με 360 μοίρες πίνακα περιστροφής για BGA & PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
UNX6030N Σύστημα ακτινοβολίας για την επιθεώρηση ξένων υποθέσεων σε λουκάνικα / σφραγισμένα / καρύδια
Food Impurity Real Time Inline Detection UNX4015N For Food-Packing Quality Inspection Application UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Easy to Operate: one button start&stop, optional default product Sensitivity adjustment, alarm management,
Η συσκευή ακτινογραφίας UNC225 της Unicomp εντοπίζει ελαττώματα στην ρητίνη ισχύος με εστιακό μέγεθος 0,4 mm/1,0 mm σε 225 kV
Unicomp UNC225 X-Ray Identifies Flaws in Power resin Mainly used in metal castings, hardware products, plastic products, refractory materials, resin materials, composite materials, ceramic body and welding metal parts and other small products for non-destructive testing. Functional Characteristics 1. Wide range of applications to meet the inspection of multiple sizes and types of products. Low failure rate, best-selling equipment for 9 years 2. Safety: High level protection,
Η Unicomp UNC225 ακτινοβολία Χ είναι η απόλυτη λύση για την ανίχνευση εσωτερικών ελαττωμάτων στην ρητίνη ισχύος
Detect Internal Defects in Power resin with Unicomp UNC225 X-Ray Primarily utilized for non-destructive testing of small items such as metal castings, hardware products, plastics, refractory materials, resin materials, composites, ceramic bodies, and welded metal components, among others. Functional Characteristics It boasts a wide array of applications, accommodating the inspection needs of various sizes and types of products. With a low failure rate, it has been a top
