x ray inspection system
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Unicomp UNC160 NDT X-Ray Inspection Equipment for Automotive Components
Unicomp UNC160 NDT X-Ray Inspection Equipment for Automotive Components Product Description Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection
Σύστημα επιθεώρησης ακτίνας X Bga μητρικών καρτών με την υπερβολικά μεγάλη περιοχή επιθεώρησης
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Σε απευθείας σύνδεση ανιχνευτής 130kv εξοπλισμού FPD επιθεώρησης ακτίνας X ADR λουρίδων των οδηγήσεων υψηλής ταχύτητας
Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Μηχανή 90kV επιθεώρησης ακτίνας X CSP για τη συγκόλληση ηλιακών κυττάρων
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Επιθεώρηση Unicomp AX8200 BGA μηχανών επιθεώρησης ακτίνας X επίδειξης 1.0kW LCD
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
320Kv CNC εξοπλισμού επιθεώρησης ακτίνας X έλεγχος για τα μέρη οχημάτων
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. System Parameters Dimensions 2100mm*1720mm*2470mm(L*W*H) Equipment weight 3.5T Power 6kW Maximum penetration (AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight
1uSv/H χαρτογράφηση εξοπλισμού BGA CNC επιθεώρησης ακτίνας X μπαταριών λίθιου
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200B The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Εξοπλισμός επιθεώρησης ακτίνας X Unicomp AX8200MAX για τον ημιαγωγό
Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable)
Ελέγχος ακτίνων Χ Unicomp UNX 1830-D Διασφάλιση ασφάλειας και ποιότητας για τα εμφιαλωμένα τρόφιμα
Unicomp UNX 1830-D X-Ray Inspection Ensure Safety and Quality for Bottled Foods Product Description: Our cutting-edge X-Ray inspection solution tailored for bottled and canned food items, ensures unparalleled quality control for glass jars, dairy goods, tin cans, and porcelain liquor bottles. It identifies contaminants with unparalleled precision, safeguarding consumer wellbeing and upholding brand integrity. Features: User-Centric Operation: Effortless one-touch activation
