x ray inspection equipment
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Μετρητής τσιπ ακτίνας X υψηλής επίδοσης, μηχανή CX6000 συστημάτων επιθεώρησης ακτίνας X
Metal X Ray Component Counter Inspection System Machine CX6000 This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the classification of
Μηχανή ακτίνας X ηλεκτρονικής AX9100 130kV για τη συνδέοντας επιθεώρηση σκουπισμάτων καλωδίων ημιαγωγών
High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Μηχανή ψηφιακών ακτίνων Χ σε πραγματικό χρόνο AX7900 για την επιθεώρηση εσωτερικών ελαττωμάτων πυκνωτών
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
Ευθύγραμμη γραμμή παραγωγής εξοπλισμού μηχανών ανιχνευτών ακτίνας X ηλεκτρονικής
Electronics X-ray Machine Inline Equipment Production Line in Asia High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is excellent for multiple applications including; PCBA, Semiconductor, Encapsulated Components, and Solar Cell just to name a few. Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power
Φορητό σκάφος σωληνώσεων του Hull ανιχνευτών ακτίνας X βιομηχανίας NDT Unicomp μετάλλων
Portable Metal Industry NDT Unicomp X ray Detector Hull Pipeline Vessel Features: ● Compact design,anodic grounding,forced air cooling; ● Light-weight,protable and convenient; ● Work and rest with 1:1 time ratio; ● Nice modeing,reasonable structure; ● Delayed exposure to keep safety. Applications: Suitable for national defense,shipbuilding,petroleum,chemical,machinery,aerospace,and construction industries inspect for material such as hull,pipeline,high pressure vessel,boiler
Μηχανή επιθεώρησης ακτίνας X συγκόλλησης, ανιχνευτής ρωγμών ακτίνας X για τη βιομηχανία ναυπηγικής
Standard Portable Real Time X Ray Inspection Equipment Flaw Detector - Unicomp Portable X-ray flaw detector is made up by x-ray generator, controller, connecting cable, power cable and accessories. - The intelligent design for controllers, the tube voltage and exposing time can be preset, the timer is digital. The controllers have over-voltage protection, over-current protection, low-current protection and exposing delay function. Strong impact resistance and anti-jamming
Ηλεκτρονική μηχανή ακτίνας X PCB με την ενσωματωμένη γεννήτρια, αλυσίδα απεικόνισης υψηλής ανάλυσης
PCB X Ray Machine with integrated generator, and a high-resolution imaging chain Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-Ray System Tube Type Closed Voltage/Current 100kv/200μA Focal Spot Size 5μm FPD Detector FPD Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm Weight 1500 kg Power 2kW System Magnificat
Μηχανή ακτίνας X υψηλής ανάλυσης PCB
Electronics PCB parts X ray Machine with a high-resolution imaging chain X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight
Ηλεκτρονική μηχανή ελέγχου ακτίνων Χ AX7900 Unicomp 5μm Micro Focus Αυτοαπογνώριση κενού BGA Solder υψηλής ακρίβειας
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
