x ray detector
"
Μόνο γραφείο AX8200B μηχανών επιθεώρησης ακτίνας X μπαταριών τηλεφωνικών παιχνιδιών στάσεων
Stand Alone Phone Toy Battery X-ray Inspection Machine Cabinet AX8200B Features: ● Off-line lithium battery detection equipment ● 100KV 5μm closed X-ray tube, Hi-resolution detector ● X-ray tube and detector can be programmed to move to Z Axis ● Automatic control of all the moving parts, Automatic programming ● Convenient target point positioning system ● Automation software judgments detection Applications: ●Lithium battery pole piece solder joint defect detection, ●Lithium
Αυτόματα συστήματα επιθεώρησης 40-120kV ακτίνας X ασφάλειας φρούτων τροφίμων για την ανίχνευση βελόνων
Food Safety Automatic X-ray Inspection Systems for Unpackaged Products Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800 Weight 500kg Safety
HD ακτίνα X 130kV Unicomp καμερών για την επιθεώρηση των πινάκων PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
μηχανή ακτίνας X ηλεκτρονικής FDA 0.8kW 5um για τη συγκόλληση SMT BGA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
NDT που πετά το συμπαγές σχέδιο μηχανών ακτίνας X NDT, ψήφισμα ανιχνευτών 2.8LP/Mm
NDT Industrial X Ray Inspection Systems Compact Design Manufacturer Unicomp UNC320 is a compact industrial X-ray inspection system designed for broad aerospace and foundry (automotive) applications. Flexible 2D inspection of casting defects and production flaws provide the confidence of a safe and reliable analysis. Features: Reliable inspection decisions based on outstanding image quality High-speed wheel inspection of the heaviest wheels with our new gripper manipulator
Ενδύματα Unicomp/τροφίμων και ποτών ενδυμάτων συστήματα επιθεώρησης 40-120kV ακτίνας X
Unicomp clothes garments X-ray Inspection Systems in Food Processing Plants detecting foreign matter Unicomp Efficient X-ray inspection systems are available for systematic detection and elimination of foreign material. They help food makers safeguard consumer health, mitigate the risk for extensive recall campaigns, and make sure that the reputation of their brands and compliance with applicable regulations remain intact. X-ray inspection systems are used wherever defects
Εσωτερικός έλεγχος ατελειών ηλεκτρονικής συστημάτων SMT ακτίνας X ηλεκτρονικής εστίασης μικροϋπολογιστών
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
Υψηλό σύστημα ακτίνας X ηλεκτρονικής ενίσχυσης για την κενή επιθεώρηση BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
CNC προγραμματίσημη εσωτερική ποιοτική επιθεώρηση σφαιρών γκολφ μηχανών ακτίνας X ηλεκτρονικής ανίχνευσης
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
