x ray detection equipment
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ακτίνα X 130kV Microfocus AX9100 Unicomp για τον αυτοκίνητο συνδετήρα
130kV Microfocus X-ray AX9100 for automotive connector inner connection quality defect wire broken inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,
Στενή ακτίνα X AX9100 130kV Unicomp σωλήνων για τα τμήματα ηλεκτρονικής
130kV close tube X-ray Equipment AX9100 with high resolution FPD for electronics components couterfeit inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
QFN των οδηγήσεων μηχανών SMT PCBA BGA ακτίνας X Unicomp AX9100 που συγκολλά την κενή μέτρηση
SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ●
AX7900 πραγματικός - μηχανή χρονικής ψηφιακή ακτίνας X για την εσωτερική επιθεώρηση ατελειών διακοπτών
Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz
AX7900 πραγματικός - μηχανή χρονικής αυτόματη σε μη απευθείας σύνδεση ακτίνας X για την εσωτερική επιθεώρηση ατέλειας ηλεκτρονικής
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
AX7900 γέρνοντας μηχανή ακτίνας X ηλεκτρονικής 25 βαθμού για την επιθεώρηση τσιπ κτυπήματος BGA CSP
AX7900 with function of tilting ±25° for better inspection effect Description of IC X Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
Εξοπλισμός 160KV ακτίνας X μετάλλων NDT χαμηλής πυκνότητας με τη φιλική προς το χρήστη διεπαφή λογισμικού
Low Density Metal Nondestructive Material Testing NDT X Ray 160KV Unicomp Technology UNC series NDT X ray real time imaging detection equipment is the standardized one for industrial NDT. Unicomp has rich experience in the design of NDT X-ray and solution of detection technology to help customers to achieve non-destructive testing in manufacturing process, research, project development and testing services, and ensure product quality. The technology and equipment are widely
Εξοπλισμός 220AC/50Hz ακτίνας X Unicomp γραφείου με το σύστημα επεξεργασίας εικόνας DXI
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Μηχανή ακτίνας X Unicom ηλεκτρονικής για την ανίχνευση ατέλειας στις επιφάνειες γκοφρετών ημιαγωγών
EMS Semiconductor Unicomp PCB X Ray Machine for Electronics BGA AX8200 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is
