real time x ray machine
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Υψηλές προδιαγραφές Ηλεκτρονικές πλακέτες 2D & 2.5D Μηχανή ακτινογραφίας X Unicomp AX9100MAX με 360 μοίρες πίνακα περιστροφής για BGA και PCB επιθεώρηση
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
Ευθύγραμμος αποτελεσματικός πραγματικός συστημάτων επιθεώρησης ακτίνας X δοκιμής συγκομιδών μη καταστρεπτικός - χρόνος για τα ξένα υλικά
Inline Crop NDT X Ray System , Effective Foreign Materials Real-time Detector Product Feature Flexibility Tooling and Fixture Easy to Operate, User-friendly Software Design Customized to Provide Solutions After-sales Service of Entire Network Low Cost of Testing Service Inspection Image:
Ηλεκτρονική μηχανή ακτίνων Χ με σταθερό σημείο παρακολούθησης κατά την κλίση FPD
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Unicomp ακτινογραφία CX3000 με συμπαγές μέγεθος και πολλαπλές λειτουργίες
Compact size Electronics X Ray Machine with moving wheels CX3000 Application of SMT X-Ray machine BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, Other Special Industries. FEATURES of Desktop X-ray machine 1. Super Compack and Desk-top Design 2. Multi-function X-Ray Inspection 3. Different Inspection Mode 4. Portable with Wheels 5. Status Light and Emergency Button 6.
Μηχανή 90kV επιθεώρησης ακτίνας X CSP για τη συγκόλληση ηλιακών κυττάρων
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Μηχανή ακτίνας X ηλεκτρονικής υψηλής επίδοσης, μηχανή ακτίνας X PCB SMT με το όργανο ελέγχου 22 ίντσας LCD
Electronics X Ray Machine SMT BGA X-ray Detection Equipment for PCB X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7
Αντίθετο εξέλικτρο τετραγώνων ακτίνας X τσιπ Unicomp SMD και δίσκος JEDEC με το δυναμικούς αλγόριθμο AI και την υποστήριξη σύννεφων
Unicomp SMD Chip Counter X Ray quad reel and JEDEC tray with dynamic AI algorithm and Cloud support Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
Μετρητής τμημάτων ακτίνας X ακρίβειας πάνω από 99,99% για τη διαχείριση καταλόγων αποθηκών εμπορευμάτων SMT EMS
Over 99.99% Accuracy X-ray Component Counter for SMT EMS warehouse inventory management Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC,
Πλήρως αυτόματος μετρητής τσιπ ακτίνας X SMD για όλη τη σειρά του εξελίκτρου, του δίσκου JEDEC και των μερών σωλήνων με τη σύνδεση cErp MES
Fully automatic SMD X Ray Chip Counter for all range of reel, JEDEC Tray and tube parts with ERP MES connection Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating
