pcb x ray inspection
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Μηχανή Microfocus AX8200 επιθεώρησης ακτίνας X 5um των οδηγήσεων CSP με CNC τη χαρτογράφηση
Unicomp 5um Microfocus AX8200 X Ray Inspection Machine For Automotive Electronics quality control with CNC mapping Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 ...
Σφραγισμένος σωλήνας μικρού υψηλής ανάλυσης AX8200B μηχανών επιθεώρησης ακτίνας X μπαταριών λίθιου Unicomp 130kV
Unicomp 5um 90kV sealed tube X-Ray Inspection Machine AX8200B for button Lithium battery inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is ...
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...
Μηχανή 22 επιθεώρησης ακτίνας X υψηλής ακρίβειας» εφαρμογή βιομηχανίας ηλεκτρονικής οργάνων ελέγχου LCD
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” ...
Unicomp AX8200max Μηχάνημα επιθεώρησης ακτίνων Χ για επιθεώρηση ελαττωμάτων καλωδίωσης
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace ...
Περιστροφή 360° CNC Αυτόματη διάταξη MOSFET PCB Σύστημα επιθεώρησης ακτίνων X AX8300MAX Unicomp Σταθερή απόδοση
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ...
Unicomp AX8200 με τη μηχανή ακτίνας X PCB FPD 100kv για την ποιοτική δοκιμή PCBA
Unicomp AX8200 automated smt pcb xray machine for computer motherboard repair The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes ...
Μηχανή ακτινογραφίας PCB υψηλών μεγεθύνσεων Unicomp AX9100MAX για ηλεκτρονικά συστατικά IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
Μεγέθος σημείου εστίασης μικρών για μηχανή ακτίνων Χ SMT PCB για μέτρηση κενών BGA και επιθεώρηση ύψους αναρρίχησης μετά τη συγκόλληση
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
