pcb inspection system
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Μηχανή ακτίνας X Benchtop Unicomp/μηχανή ακτίνας X ηλεκτρονικής για τα εργαστήρια ανάλυσης αποτυχίας
Benchtop Electronics X-ray Machine for failure analysis laboratories Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
Πλαστός ανιχνευτής AC110V ακτίνας X ηλεκτρονικής 0.8kW για το πηνίο διόδων
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
CNC προγραμματίσημη 1,0 KW μηχανή ακτίνας X για τη λαϊκή συσκευασία SMT BGA QFP
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
μηχανή ακτίνας X ηλεκτρονικής FDA 0.8kW 5um για τη συγκόλληση SMT BGA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
κενή μηχανή ακτίνας X μέτρησης 0.8kW BGA για το κινητό τηλέφωνο PCBA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)×1180(D)×1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)×128(D)×196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (option 4’’ i.i. Detector)Pixel Size85μmEffective Detection Area130*130mmFrame Rates20fpsPi
Ηλεκτρονική μηχανή ακτίνων Χ με σταθερό σημείο παρακολούθησης κατά την κλίση FPD
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Σύστημα ακτινογραφίας AX9100max με αλγόριθμους για την ανασυγκρότηση εικόνας υπερεκτίμησης
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Μέτρηση καμπυλότητας IC Μηχανή ακτινογραφίας Unicomp AX9100MAX με 84μm μέγεθος pixel και γωνία κλίσης 60°
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
90KV Micron Focus Spot Size Tube X-Ray Machine Unicomp Αναβαθμισμένο μοντέλο AX7900 με διπλό υπολογιστή για τον έλεγχο της ποιότητας του κινητού τηλεφώνου
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
