metal detector x ray machine
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Αναβάθμιση σε ανιχνευτή επίπεδης οθόνης FPD Εξοπλισμός ελέγχου ακτίνων Χ για IC με 1536 * 1536mm Pixel Matrix
X-Ray Inspection Equipment for IC Description of IC X Ray machine AX7900: It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and Photovoltaic Industry, to name a few. FEATURES of IC Xray machine AX7900: Precision Positioning Laser Pointer System Installed on a Large Inspection Table Accurate Control, CNC
Μηχανή AX8200MAX ακτίνας X υψηλής ανάλυσης για την εσωτερική επιθεώρηση ατελειών τσιπ Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
Πετώντας μηχανή επιθεώρησης ακτίνας X αργιλίου για τις κοιλότητες που πετούν τις ατέλειες
Cavities Casting defects Metal X Ray Machine Industrial Quality Management Unicomp Technology automated x-ray systems inspect steel or aluminum alloy castings expressly for the automotive industry. The automated radioscopic inspection of aluminum die castings can be performed for an audit-based or production-level scale. Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for medium•large size component
10 NDT KW εξοπλισμού ακτίνας X για τις ατέλειες Heatsinks ρίψης/τα καυτά δάκρυα/την κρύα ροή
Casting defects heat sinks, hot tears, cold-flow, drag-marks, missing material and cracks NDT X-Ray Inspection Application Fields of X Ray Machine UNZ-450 ● Engineering components ● Small aluminum castings, iron castings ● Auto parts, metal products Technical Parameters and Specifications of X Ray Machine UNZ-450 System Parameters Dimensions 2766mm*2813mm*2598mm(L*W*H) Equipment weight 17.5T Power 10 kW Maximum penetration (FE) 80 mm Detection range Φ550*200mm Load weight
Εξοπλισμός ελέγχου ακτίνων Χ με μεγέθυνση συστήματος 600X για ηλεκτρικό ξυράφι με μέγεθος pixel 85μm
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It is broadly utilized in various sectors such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small-scale Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, and more. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC Programming
Εξοπλισμός ελέγχου ακτινογραφίας μεγέθους εστίασης 5μm για PCBA 1100kg χωρητικότητα
X-Ray Inspection Equipment for PCBA Description of IC X Ray machine AX7900: It is widely employed across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC
Μηχανή ακτίνων Χ 90kv υψηλής ανάλυσης Unicomp AX7900 με σωλήνα 5um για δοκιμή καμπυλότητας καλωδίων BGA
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
Εξοπλισμός 220AC/50Hz ακτίνας X Unicomp γραφείου με το σύστημα επεξεργασίας εικόνας DXI
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Φορητό σκάφος σωληνώσεων του Hull ανιχνευτών ακτίνας X βιομηχανίας NDT Unicomp μετάλλων
Portable Metal Industry NDT Unicomp X ray Detector Hull Pipeline Vessel Features: ● Compact design,anodic grounding,forced air cooling; ● Light-weight,protable and convenient; ● Work and rest with 1:1 time ratio; ● Nice modeing,reasonable structure; ● Delayed exposure to keep safety. Applications: Suitable for national defense,shipbuilding,petroleum,chemical,machinery,aerospace,and construction industries inspect for material such as hull,pipeline,high pressure vessel,boiler
