industrial x ray equipment
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22» ηλεκτρονική υψηλή ανάλυση εξοπλισμού επιθεώρησης ατελειών συγκόλλησης οργάνων ελέγχου SMT EMS LCD
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,
Εσωτερικός έλεγχος ατελειών ηλεκτρονικής συστημάτων SMT ακτίνας X ηλεκτρονικής εστίασης μικροϋπολογιστών
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
Υψηλό σύστημα ακτίνας X ηλεκτρονικής ενίσχυσης για την κενή επιθεώρηση BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
CNC προγραμματίσημη εσωτερική ποιοτική επιθεώρηση σφαιρών γκολφ μηχανών ακτίνας X ηλεκτρονικής ανίχνευσης
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
Πολυ - υψηλή ταχύτητα μηχανών ακτίνας X ηλεκτρονικής λειτουργίας πραγματική - χρόνος για τη χρυσή σφαίρα
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
Σφαίρα γκολφ μηχανών ακτίνας X ηλεκτρονικής επιθεώρησης PCB BGA μέσα στον ποιοτικό έλεγχο
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
Τροφική βιομηχανία και ποτά Μηχανή ακτίνων Χ Αλγόριθμος βαθιάς μάθησης AI Αναγνωρίζει και αφαιρεί αυτόματα ξένα αντικείμενα
UNX 4015 X-ray system for Prawn candy vegetable poultry dumplings foreign matters detection APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone,
Υψηλή ταχύτητα Unicomp μηχανών ακτίνας X ηλεκτρονικής SMT PCBA ευθύγραμμη με τον αυτοκίνητο προσδιορισμό
Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Πραγματικός - χρονικής NDT ακτίνας X εξοπλισμού unc160-γ-λ γενική ανίχνευση αυτόματης θέσης χρησιμοποίησης ευθύγραμμη
General Utilization Inline NDT Real time UNC160-C-L with outstanding image quality FEATURES: * The implementation of automatic location detection * Automatic identification of defect detection * The unqualified product identification marking * OK and NG are sorting and recognition * High contrast, high quality image detection * Extended-modular design, strong, automatic loading and unloading * Adopt the design of transmission mechanism of high speed positioning, multi axis
