industrial inspection systems
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Εξοπλισμός ακτίνας X Unicomp ηλεκτρονικής ποιοτικής ανίχνευσης AX7900 λουριών καλωδίων
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Μηχανή Unicomp AX7900 ακτίνας X PCB υψηλής ανάλυσης 90kV Benchtop για τα ηλεκτρονικά συστατικά
5 μm Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing Description of AX7900 : 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
Ηλεκτρονική μηχανή ακτίνων Χ ακριβής έλεγχος CNC προγραμματισμός για την ανίχνευση ελαττωμάτων chipset
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Ακτίνα X 130kV Unicomp χαρτογράφησης Microfocus AX9100 CNC για τη μητρική κάρτα
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Μηχανή 5um AX8500 ακτίνας X ηλεκτρονικής ημιαγωγών 110kV για PCBA BGA
110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
εξοπλισμός CNC ακτίνας X 5um SMT προγραμματίσημος για τα κενά EMS BGA
5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Μηχανή ακτίνων Χ Unicomp AX9180 180kV Microfocus Electronics με FPD Oblique
Unicomp AX9180: Ακτινογραφία μικροεστίασης 180 kV με μέγεθος σημείου 10μm, κλίση 60° και σύνδεση 7 αξόνων. Το FPD υψηλής ανάλυσης προσφέρει μεγέθυνση 1000X για ακριβή επιθεώρηση PCB, BGA και ημιαγωγών. Περιλαμβάνει εγγύηση 1 έτους και προγραμματισμό εκτός σύνδεσης.
Διακένωση SMT σφουγγαριών/τεχνολογία Unicomp μηχανών ακτίνας X EMS για το τμήμα κιβωτίων ταχυτήτων
Gearbox Section Sponge Shrinkage Metal X Ray Detection Machine in Malaysia Unicomp Technology UNC series offer dynamic lines of imaging systems and services for automotive components that detect defects. Safety-critical cast component manufacturers utilize x-ray inspection technology to verify casting integrity. Casting defects such as cavities, gas, inclusion, tearing, foreign material, porosity, shrinkage and sponge are found quickly and objectively using x-ray inspection.
Υψηλή ακρίβεια κίνησης 90kV σφραγισμένο σωλήνα MOSFET Ημιαγωγός Συστατικό Εξοπλισμός ακτινογραφίας AX7900 Ελέγχος ποιότητας Unicomp
Electronic Semiconductor X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is an advanced micro-focus X-ray NDT system manufactured by UNICOMP Technology.It delivers ultra-clear internal defect imaging for semiconductor packaging, SMT assembly and electronic component quality inspection.Adopting independently manufactured X-ray tubes and professional image analysis software, it effectively inspects solder voids, welding defects, PCB internal layers, battery cells and precision
