bga x ray machine
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Σύστημα ακτινογραφίας Unicomp AX8200max με πολλαπλά εργαλεία μέτρησης
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
100KV ευθύγραμμο σύστημα ανίχνευσης ADR ακτίνας X BGA EMS για την εσωτερική ποιοτική επιθεώρηση
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Real-time image. ● 1000X system magnification. ● 100KV 5μm X-Ray tube. ● Modular design with In-line expansibility. ● Economical and Practical. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
CNC ανιχνευτής ακτίνας X προγραμματισμού αυτόματος για PCBA BGA CSP QFN
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Test Images: Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 5μm X-Ray tube. ●
Πραγματικός - ακτίνα X 1.6kW AX9100 χρονικού Unicomp για τη συνέλευση ηλεκτρονικής
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
Ανιχνευτής 5um ακτίνας X 110kV των οδηγήσεων CSP για τη συγκόλληση λουρίδων PCBA των οδηγήσεων
110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size
Μηχανή ακτίνων Χ 90kv υψηλής ανάλυσης Unicomp AX7900 με σωλήνα 5um για δοκιμή καμπυλότητας καλωδίων BGA
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
Σύστημα επιθεώρησης 130kV 3um ακτίνας X Microfocus Unicomp για την εικόνα FPD
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
ενισχυτής ακτίνας X FPD 130kV 3um Microfocus για τη συγκόλληση αργιλίου PCBA
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Ακτίνα X AX7900 0.8KW Unicomp σωλήνων PCBA 5um για τη συνέλευση PCB
Unicomp 5um close tube AX7900 X-ray for printed circuit board assembly PCBA process quality inspection of Void Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
