bga x ray machine
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22» μηχανή ακτίνας X ηλεκτρονικής Unicomp AX8200B για την μπαταρία πολυμερούς λίθιου
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes
Σφραγισμένος 90kV σωλήνας μεγέθους μηχανών 5um Focu ακτίνας X μπαταριών λίθιου κουμπιών Unicomp AX8200B
Unicomp 5um 90kV sealed tube X-Ray Inspection Machine AX8200B for button Lithium battery inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process
Unicomp AX8200 με τη μηχανή ακτίνας X PCB FPD 100kv για την ποιοτική δοκιμή PCBA
Unicomp AX8200 automated smt pcb xray machine for computer motherboard repair The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Μηχανή Unicomp AX8200B ακτίνας X ηλεκτρονικής μπαταριών λίθιου
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
Κλειστοί συνδετήρες λουριών καλωδίων σωλήνων ακτίνας X ηλεκτρονικής Unicomp AX8200 μηχανή
Cable Harness Connectors Quality Inspection by Unicomp AX8200 Microfocs X-ray with high resolution FPD Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing
Αυτόματη μέτρηση συστημάτων επιθεώρησης ακτίνας X ηλεκτρονικής BGA ατέλειας πυκνωτών εσωτερική
Capacitor Inner Defect Inspection with Electronics X-ray 100 KV Power AX8200MAX Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic
Μηχανή ακτίνας X ηλεκτρονικής καμερών BGA QFN DFN CCD
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector FPD Active Area: 130mm*130mm Resolution 58 LP/cm Camera 2 Mega Pixel CCD Motion range (Up and Down) 290mm
Ψηφιακή μηχανή ακτίνας X δεσμών 1kW 90KV καλωδίωσης BGA Viods
Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector FPD Active Area: 130mm*130mm Resolution 58 LP/cm Camera 2 Mega Pixel CCD Motion range (Up and Down) 290mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area
Μηχανή ακτινοβολίας ακτινοβολίας σωλήνα μεγέθους σημείου εστίασης 130KV AX9100MAX με διπλό υπολογιστή για επιθεώρηση PCB & BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
