bga x ray machine
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Μηχανή 1.3kW ακτίνας X ηλεκτρονικής HD FPD για τα τσιπ ολοκληρωμένου κυκλώματος Semicon
HD FPD Electronics X Ray Machine 1.3kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm
Ανιχνευτής Unicomp μηχανών 90kV FPD ακτίνας X ηλεκτρονικής EMS SMT
EMS SMT Electronics X Ray Machine 90kV FPD Detector Unicomp Original manufacturer SMT Equipment Electronics X Ray Machine on IC chips wire Analysis Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging
Υψηλές αναλύσεις επιθεώρησης PCB PCBA BGA μηχανών SMT ακτίνας X AX7900 Unicomp
Unicomp AX7900 X-Ray machine with high resolutions FPD for SMT Printed circuit board PCBA BGA inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
Απεικόνιση υψηλής ευκρίνειας 2.5D Επικαλυπτόμενη κενή ακτινογραφία BGA AX9100 UNICOMP SMT Εξοπλισμός επιθεώρησης συγκροτήματος
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void detection capabilities for BGA components. Key Features 130KV 7μm X-Ray tube for precise imaging High-speed, high-resolution FPD with millions of pixels 1000X magnification with high
Κλίση 60° Πολυγωνική Σάρωση Ανίχνευσης ελαττώματος κρυφής συγκόλλησης PCBA BGA ακτίνων Χ AX9100 UNICOMP Μηχάνημα ημιδοκιμών
60° Tilt Multi-angle Scan Hidden Solder Defect Detection PCBA BGA X-ray AX9100 UNICOMP Semi Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1000X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming
Αρχικός κατασκευαστής της μηχανής ακτίνας X για τα τσιπ ολοκληρωμένου κυκλώματος και τη συστατική πλαστή επιθεώρηση
Original Manufacturer of X-ray machine for IC chips and component counterfeit inspection Specifications of Xray machine AX7900: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Μηχανή 5um AX8500 ακτίνας X ηλεκτρονικής ημιαγωγών 110kV για PCBA BGA
110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Μηχανή ακτινογραφίας υψηλής διείσδυσης Unicomp AX7900 για την επιθεώρηση πλακών κυκλωμάτων
PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection
Η συσκευή ακτινογραφίας PCBA AX7900 με υψηλό ανιχνευτή επίπεδης επιφάνειας για την επιθεώρηση των εξαρτημάτων IC
PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection
