automatic x ray machine
"
Σε μη απευθείας σύνδεση AX8200Max SMT EMS ακτίνας X μέτρηση χαρτογράφησης μηχανών αυτόματη
Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot
AX8200max μηχανή 90kV ακτίνας X PCB με τη λειτουργία της κλίσης ±60° για την επίδραση επιθεώρησης
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Application Fields of SMT X-Ray machine Unicomp AX8200MAX BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive
Μηχανή ψηφιακής ακτινογραφίας NDT UNC450 Unicomp Μηχανή ακτινογραφίας για τη δοκιμή της προσιτότητας ανταλλακτικών αυτοκινήτων
NDT digital radiagraphy UNC450 Unicomp X-ray machine for testing automotive spare part prosity Product Description: This specialized equipment is primarily used for non-destructive testing across a wide variety of materials and products. It is extensively applied in inspecting metal castings to guarantee the structural integrity of intricate metal components, as well as hardware products that range from nuts and bolts to precision-machined parts. Manufacturers also benefit
Ρίψη κύβων αλουμινίου SMT/CNC μηχανών ακτίνας X EMS προγραμματίσημη ανίχνευση για τα κενά BGA
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 3µm closed X-ray tube, high speed &
Ανάλυση της ευθύγραμμης μηχανής LX2000 FPC ακτίνας X ηλεκτρονικής SPC για τη συγκόλληση BGA QFN
Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
IP66 αυτόματη μηχανή ακτίνας X Rejector για τη βιομηχανία τροφίμων UNX4015N
IP66 Auto Rejector X Ray Machine For Food Industry UNX4015N Food X-Ray Inspection for checking dry pack food contamination with auto rejector Technical Specifications of Food Xray machine Equipment Features Dimension 1168(W)X985(D)X1510(H)mm Machine weight 500kg X-ray tube 80-120kv/210-480W Power Supply AC 110/220V, 50/60Hz Max. Loading weight 10kg X-ray detector Diode array with 0.4mm resolution Channel size 400mm(W)*150mm(H) Conveyor Speed 10-60M/min Heavy load Conveyor
Μηχανή ακτινοβολίας 160KV Unicomp UNC450 Για μη καταστροφική δοκιμή κυλίνδρων αυτοκινητοβιομηχανικών εξαρτημάτων
160KV X-ray machine Unicomp UNC450 for cylinder automotive casting parts non-destructive testing Product Description: This specialized equipment is primarily utilized for conducting non-destructive testing across a diverse range of materials and products. It finds extensive application in examining metal castings to ensure the integrity of intricate metal structures, as well as hardware products ranging from nuts and bolts to precision-engineered machinery parts. Plastic
Μηχανή ακτινογραφίας υψηλής μεγέθυνσης Unicomp AX7900 για έλεγχο ποιότητας μεταχειρισμένων κινητών τηλεφώνων
High magnifications X-ray machine Unicomp AX7900 for used mobile phone quality inspection Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming Automatic
SMT PCB Μηχανή ακτινογραφίας υψηλής ανάλυσης Μικρόνια Στόχος Σημείο Μεγέθους Unicomp AX7900 Για κινητό τηλέφωνο Εσωτερική ποιότητα και ρήξεις Επιθεώρηση
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
