automatic x ray machine
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Μη καταστρεπτική εξεταστική υψηλή διείσδυση UNC 450kV λεπίδων NDT μηχανών αεροπλάνων
High Penetration None-Destructive Testing (NDT) X-Ray Machine UNC450kV For Airplane Engine Blade Testing Features: ● High reliable and long life,low breakdown; ● High definition and resolution FPD; ● C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend); ● Multi-functional workstation,360°rotation and shift; ● User friendly software design for easy interfacing can facilitate,customized software ; ● High penetration,Voltage up to 450KV
Αντίθετος BGA μικροϋπολογιστής BGA μηχανών επιθεώρησης ακτίνας X τσιπ στην ανάλυση μπριζολών
Chip Counter BGA X Ray Inspection Machine Micro BGA on chop analysis X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to
Τα τμήματα τσιπ cErp 1.1kW SMD αντιμετωπίζουν για την παραγωγή SMT
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Το microfocus 90KV 5um έκλεισε το σύστημα επιθεώρησης ακτίνας X σωλήνων με τη υψηλή ανάλυση FPD για PCBA που συγκολλά το κενό checki ατελειών
90KV 5um microfocus closed tube X-ray Inspection System with high resolution FPD for PCBA soldering void Defects checki Application Fields of X-ray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD
Ο εξοπλισμός ελέγχου ακτίνων Χ της Unicomp X-ray AX8300 Plus
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
Κανένας αντίθετος 440mm ακτίνας X ζημίας τσιπ αυτόματος υπολογισμός μεγέθους σηράγγων τσιπ με τον ευθύγραμμο τρόπο
Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity
Υψηλής ακρίβειας PTH διασωλήνωσης PCB συναρμολόγηση ακτίνων Χ AX7900 Unicomp Υψηλή σταθερότητα
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
99.8% αντίθετη γρήγορη ταχύτητα ακτίνας X ακρίβειας επιθεώρησης με τη μετρώντας ικανότητα 01005
Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity
0.1m/s αυτόματο αντίθετο 440mm ακτίνας X SMD μέγεθος σηράγγων τσιπ για τη μεγάλη επιθεώρηση εξελίκτρων
Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity
