automatic x ray machine
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Περιστροφή 360° CNC Αυτόματη διάταξη MOSFET PCB Σύστημα επιθεώρησης ακτίνων X AX8300MAX Unicomp Σταθερή απόδοση
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Features 1. Professional semiconductor inspection configuration with 5μm ultra-high resolution 2. Extended detection scope,
CNC προγραμματίσημη εσωτερική ποιοτική επιθεώρηση σφαιρών γκολφ μηχανών ακτίνας X ηλεκτρονικής ανίχνευσης
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
Πολυ - υψηλή ταχύτητα μηχανών ακτίνας X ηλεκτρονικής λειτουργίας πραγματική - χρόνος για τη χρυσή σφαίρα
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
Σφαίρα γκολφ μηχανών ακτίνας X ηλεκτρονικής επιθεώρησης PCB BGA μέσα στον ποιοτικό έλεγχο
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
Αυτόματα τρόφιμα Unicomp πλήρως μέσω της μηχανής ακτίνας X για τη γραμμή παραγωγής ποτών
System Specifications: Model UNF - 1630 Best Inspection Ability 0.5mm(SUS304 ball) 0.3*2mm(SUS304 wire) 1.5 mm (Glass Ball) 1.5 mm(Ceramic Ball) X-ray tube MAX. 480W/120kV, 8mA Detector Pixel size 0.4mm Max Detecting Height 300mm Max Detecting Width 160mm Conveyor Parameter Speed 10-60m/min (Adjustable) Width 150mm Screen Full-color TFT 15" Touch Screen O/S Windows 7 Professional Connectivity LAN port, USB port Product Management Complete product log Parameter Adjustment Auto
Σύστημα επιθεώρησης ακτίνας X ημιαγωγών SMT Bga για την εσωτερική ανίχνευση ατελειών
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 7µm closed X-ray tube, high speed &
Μετρητής τσιπ ακτίνας X υψηλής επίδοσης, μηχανή CX6000 συστημάτων επιθεώρησης ακτίνας X
Metal X Ray Component Counter Inspection System Machine CX6000 This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the classification of
Εξοπλισμός επιθεώρησης ημιαγωγών ακτίνας X
Highly flexible semiconductor inspection system PCB X Ray Machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection
Σύστημα ακτινογραφίας ακτινογραφίας γραφείου Unicomp CX3000 για την επιθεώρηση εσωτερικών ελαττωμάτων ηλεκτρονικών εξαρτημάτων
Compact size Electronics X Ray Machine with moving wheels CX3000 Application of SMT X-Ray machine BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, Other Special Industries. FEATURES of Desktop X-ray machine 1. Super Compack and Desk-top Design 2. Multi-function X-Ray Inspection 3. Different Inspection Mode 4. Portable with Wheels 5. Status Light and Emergency Button 6.
