Microfocus X Ray
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Ο εξοπλισμός ελέγχου ακτίνων Χ της Unicomp X-ray AX8300 Plus
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
Μηχανή ακτίνων Χ Unicomp AX9180 180kV Microfocus Electronics με FPD Oblique
Unicomp AX9180: Ακτινογραφία μικροεστίασης 180 kV με μέγεθος σημείου 10μm, κλίση 60° και σύνδεση 7 αξόνων. Το FPD υψηλής ανάλυσης προσφέρει μεγέθυνση 1000X για ακριβή επιθεώρηση PCB, BGA και ημιαγωγών. Περιλαμβάνει εγγύηση 1 έτους και προγραμματισμό εκτός σύνδεσης.
Υψηλή μηχανή Microfocus επιθεώρησης ακτίνας X συγκόλλησης Unicomp ανάλυσης εικόνας ολοκληρωμένου κυκλώματος
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
ακτίνα X AX9100 130kV Microfocus Unicomp για τη μέτρηση κενών BGA QFN των οδηγήσεων SMT
130kV Microfocus X Ray Inspection Machine Unicomp AX9100 For SMT LED BGA QFN Voids measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition
Μηχανή ακτίνας X ηλεκτρονικής AX9100 130kV Microfocus με την πλάγια άποψη 360 FPD πίνακας περιστροφής
AX9100 130kV microfocus X-ray with FPD oblique view and 360°rotation table for electronic components check Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of Unicomp AX9100: ● SMT, BGA, CSP, Flip
ακτίνα X 130kV Microfocus AX9100 Unicomp για τον αυτοκίνητο συνδετήρα
130kV Microfocus X-ray AX9100 for automotive connector inner connection quality defect wire broken inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,
Υψηλή ενίσχυση Microfocus AX9100 130KV ακτίνας X Unicomp ημιαγωγών ολοκληρωμένου κυκλώματος
Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification,
Πηγές Unicomp AX8300 ακτίνας X μηχανών ακτίνας X PCB υψηλής δύναμης για τις οδηγήσεις
High power X ray sources PCB X Ray Machine Unicomp AX8300 for LED X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1. Semiconductor package 2. Electronic connector module. 3.
Μηχανή 1.3kW ακτίνας X ηλεκτρονικής HD FPD για τα τσιπ ολοκληρωμένου κυκλώματος Semicon
HD FPD Electronics X Ray Machine 1.3kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm
